2025第 30 届 DesignCon技术展PPT资料合集（共185套打包）

更新时间：2026-05-18 报告数量：185份

2025第 30 DesignCon技术展PPT资料合集

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2025第 30 届 DesignCon技术展PPT资料合集

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- 2025第 30 届 DesignCon技术展PPT资料合集
  - DC25_SLIDES_Track9_400GElectricalPathfinding_Martin.pdf
  - DC25_SLIDES_Track4_FittingLowerLossintoMore_Frankosky_V2.pdf
  - DC25_SLIDES_Track14_FlowModelCanGiveYou_HyunjunAn_V2.pdf
  - DC25_SLIDES_TRACK13_FreeSignalIntegrityHowUnderstanding _Skytte_FINAL.pdf
  - DC25_SLIDES_Track12_AccurateAdapterRemovalInHigh_Zhou.pdf
  - DC25_SLIDES_Track09_PostFECBERAnalysisof200Gbs_Barrie_V2.pdf
  - DC25_SLIDES_Track5_OffChipDesignMethodFor_Park.pdf
  - DC25_SLIDES_Track6_IBIS-AMIModelingBidirectionLink_Rao.pdf
  - DC25_SLIDES_Track4_UseOfThinFilmResistorsIn_Andresakis_V2.pdf
  - DC25_SLIDES_Track3_DevelopmentOfACo-PackagedApplication_XU_V2.pdf
  - DC25_SLIDES_Track14_ImpedanceProfilePredictionAndClassification_Hassab.pdf
  - DC25_SLIDES_TRACK13_InsertionLossOfMechanicallyRoughened_Steinberger.pdf
  - DC25_SLIDES_Track12_MethodologyAccuratePCIeReceiverTesting_Stangel_V3.pdf
  - DC25_SLIDES_Track10_HighEfficiencyTimingAwarePower_Xiao_V3.pdf
  - DC25_SLIDES_Track07_IntraPairSkew224G_Grant_V2.pdf
  - DC25_SLIDES_Track6_DirectToSubstrateCPC_Krooswyk.pdf
  - DC25_SLIDES_Track4_ModelingAndParameterExtractionOf_Jiang-V2.pdf
  - DC25_SLIDES_TRACK2_ModelingAndStudyOfNonLinearity_Bhardwaj_V4.pdf
  - DC25_SLIDES_Track14_FoundationalModelApproachForSIPI_Kashyap.pdf
  - DC25_SLIDES_Track13_ReducedOrderGeometricMacroModel_McMorrow.pdf
  - DC25_SLIDES_Track13_InnovativeDesignOf224GBGA_Kang_V2.pdf
  - DC25_SLIDES_Track12_TransmitterPowerSpectralDensityNoise_dePaulis_v3.pdf
  - DC25_SLIDES_Track12_ArbitraryWaveformGenerator AssistedDigitalization_Yuan_V2.pdf
  - DC25_SLIDES_Track10_ParameterExtractionMethodfor_Zhang.pdf
  - DC25_SLIDES_Track10_DeterminingTheRequirementsDievsPackage_Phillips_v02.pdf
  - DC25_SLIDES_Track8_STARTSelfAdaptingToolFor_Bouse.pdf
  - DC25_SLIDES_Track5_PSIJBasedIntegratedPowerIntegrity_Shin.pdf
  - DC25_SLIDES_Track4_BootCampHowPCBDesign_Cooke.pdf
  - DC25_SLIDES_Track1_ReducingChipsRespinRate_Zamek.pdf
  - DC25_SLIDES_Track14_DeepReinforcementLearningBasedDesign_Ryu 2025-01-21 16.32.01.pdf
  - DC25_SLIDES_Track13_ParameterizedCOMAnalysisTool_Pupalaikis.pdf
  - DC25_SLIDES_Track13_CascadedPackageToPCBChannel_Peng.pdf
  - DC25_SLIDES_Track12_PerspectivesManagingIntraPairSkew_Kocsis_V2.pdf
  - DC25_SLIDES_Track11_TutorialCharacterizationOfShieldingEffectiveness_Mayevskiy_V2.pdf
  - DC25_SLIDES_Track10_NovelMultiPowerDomainPCBDecap_Manoharan.pdf
  - DC25_SLIDES_TRACK09_PanelOIFUpdateOn224G_Tracy.pdf
  - DC25_SLIDES_Track07_InvestigationOfPinFieldCrosstalk_Luoh_V2.pdf
  - DC25_SLIDES_Track07_ExploringCopprLinkAndTheFuture_Kocsis.pdf
  - DC25_SLIDES_Track05_InnovativeLayoutOptimizationMethodologyVia_Ilamparidhi_V2.pdf
  - DC25_SLIDES_Track04_HighSpeedAndHighDensity_Shen_V3.pdf
  - DC25_SLIDES_Track02_EffectiveContinuousTimeLinearEqualizer_LIU.pdf
  - DC25_SLIDES_TR10_BalancingCurrentDensityToHigh_Hostetler.pdf
  - DC25_SLIDES_Track6_112GSIInvestigationForImmersionCooling_Akinwale.pdf
  - DC25_SLIDES_Track1_StatisticalModelingOfSystemPowerIntegrity_Sharma_V2.pdf
  - DC25_SLIDES_Track13_PathToPCIeGen7Challenges_Pandankerilshaji.pdf
  - DC25_SLIDES_Track12_PracticalImplementationOfInsertionLoss_Diminico_V3.pdf
  - DC25_SLIDES_Track8_NavigatingTheIntricaciesOfPcieGen6_zahrein.pdf
  - DC25_SLIDES_Track10_PanelPowerDeliveryStrategiesFor_Dannan.pdf
  - DC25_SLIDES_Track3_NextGeneration224GbpsPAM4Linear_Li.pdf
  - DC25_SLIDES_Track07_NextGen224GbpsChipToChipMR_Wu.pdf
  - DC25_SLIDES_Track1_ANovelThermoFlowUniformizerApplied_Son.pdf
  - DC25_SLIDES_TRACK07_GeneticAlgorithmDrivenIBISAMI_Auge_V2.pdf
  - DC25_SLIDES_TRACK13_TutorialHowInterconnectsWork_CrosstalkAnatomyAndQuantification_Shlepnev.pdf
  - DC25_SLIDES_Track06_Beyond200GChallengesTowards400GSystems_Radashkevich_V2.pdf
  - DC25_SLIDES_Track13_ItTakesAVillage224G_Kocsis.pdf
  - DC25_Slides_Track04_StudyofTDRimpedanceand_Tang_V2.pdf
  - DC25_SLIDES_Track13 Beyond200GBrickwallsOf400G_dePaulis.pdf
  - DC25_SLIDES_Track02_FastBERAnalysisTechniquefor_Pang.pdf
  - DC25_SLIDES_Track12_MultiplePulsesBasedDecisionFeedbackEqualizer_Tan.pdf
  - DC25_SLIDES_TR13_ViaDesignFor112GbpsAndBeyond_Manukovsky 2025-01-24 15.07.46.pdf
  - DC25_SLIDES_Track11_MagneticShieldingEffectivenessSimulation_Nguyen_V2.pdf
  - DC25_SLIDES_Drive_TutorialEMCEMISituations_Foelkel_V2.pdf
  - DC25_SLIDES_TRACK10_In-SituSystemLevelPDNMeasurements_Bogatin.pdf
  - DC25_SLIDES_Drive_ResurrectingDeadTesla_O'Conner_REVISED.pdf
  - DC25_SLIDES_Track09_DeepDivingIntoSimilaritiesAnd_Shimanouchi.pdf
  - DC25_SLIDES_Chiphead_PanelTheExpandedRoleOf_Loberg.pdf
  - DC25_SLIDES_Track07_IntrapairSkewElectricalDelayCompensation_Zhang.pdf
  - DC25_SLIDES_Track07_AnFMBasedSideChannel_ Krotnev.pdf
  - DC25_SLIDES_Track05_InnovativeInterposerSolutionsforHBM_Ilamparidhi_V4.pdf
  - DC25_SLIDES_Track03_DesignAndPerformanceEvaluationOf_kang.pdf
  - DC25_SLIDES_TRACK01_UsingResponseSurfaceMethodology_Neally_v3.pdf
  - DC25_SLIDES_Drive_SolvingTheChallengeOfSoftware_Joshi.pdf
  - DC25_SLIDES_Track05_CAMMNewStandardMemory_Kocsis.pdf
  - DC25_SLIDES_Track13_TutorialCOMFieldGuideSerial_ Banas.pdf
  - DC25_SLIDES_Track12_TutorialChannelDeEmbeddingMethodology_Choi_V2.pdf
  - DC25_SLIDES_Track10_ThermalAnalysisandOptimizedDesign_Bae_V2.pdf
  - DC25_SLIDES_Track07_SolvingAKeySignalIntegrityBottleneck_Liu.pdf
  - DC25_SLIDES_Track06_PanelPCIExpressAndPAM4_Alavi.pdf
  - DC25_SLIDES_Track02_PanelPoweringTheAISemiconductorStack_Zou.pdf
  - DC25_SLIDES_KeynoteElectronicsForFutureHigh_Haber_V2.pdf
  - DC25_SLIDES_Drive_OmidaResearchAutomotiveSoftwareAdvances_Kyle.pdf
  - DC25_SLIDES_14_LargeLanguageModelEnabledEngineering_Kumar.pdf
  - DC25_SLIDES_Track07_NovelMethodForImprovingDifferential_Bloch_V3.pdf
  - DC25_SLIDES_Track07_IBIS-AMI_ModelingSimulationDMTPrep448G_Rao.pdf
  - DC25_SLIDES_Track06_EnhancedApplicationofHigh-SpeedFlexibleMaterialsintheArchitecture_shen_v2.pdf
  - DC25_SLIDES_Track04_TheInfluenceofCopperCrystal_shen.pdf
  - DC25_SLIDES_TRACK02_ModelingGDDR7PAM3DualBranch_Allred.pdf
  - DC25_SLIDES_TRACK01_ChipOnBoardAndModifiedSAP_Khan_V2.pdf
  - DC25_SLIDES_Drive_TutorialFeedingTheBeastConsumption_Beeker.pdf
  - DC25_SLIDES_Drive_RippleCurrentAnIncreasinglyRelevant_Mao.pdf
  - DC25_SLIDES_Drive_MovingTowardsSoftwareDefinedVehicles_Bernabeu.pdf
  - DC25_SLIDES_Drive_AcceleratingNext-GenVehicleDesign_Schneider_v2.pdf
  - DC25_PAPER_Track9_LowLatencySpeculativeErrorCorrection_Nir_V10.pdf
  - DC25_PAPER_Track5_OffChipDesignMethodFor_Park_V2.pdf
  - DC25_PAPER_TRACK1_StatisticalModelingOfSystemPowerIntegrity_Sharma.pdf
  - DC25_PAPER_Track14_FoundationalModelApproachForSIPI_Kashyap_V2.pdf
  - DC25_PAPER_Track13_ReducedOrderGeometricMacroModel_McMorrow_Final.pdf
  - DC25_PAPER_Track13_InnovativeDesignOf224GBGA_Kang.pdf
  - DC25_SLIDES_Drive_StackingTheDeckMaximizingThe_Beeker.pdf
  - DC25_PAPER_Track13 Beyond200GBrickwallsOf400G_dePaulis_v2.pdf
  - DC25_SLIDES_Drive_PredictionOfDielectricConstantAnd_Hernandez.pdf
  - DC25_PAPER_Track12_MethodologyAccuratePCIeReceiverTesting_Stangel_V3.pdf
  - DC25_PAPER_Track4_FittingLowerLossintoMore_Frankosky V2.pdf
  - DC25_PAPER_Track14_FlowModelCanGiveYou_HyunjunAn_V3.pdf
  - DC25_SLIDES_Drive_ManufacturingChallengesAndTheirImpact_Salman.pdf
  - DC25_PAPER_Track8_NavigatingTheIntricaciesOfPcie_zahrein_V3.pdf
  - DC25_PAPER_Track1_ReducingChipsRespinRateBy _Zamek_V2.pdf
  - DC25_SLIDES_Keynote_TheTransformativePowerOfAccelerated_Linford.pdf
  - DC25_SLIDES_Drive_PanelOpportunitiesForSecurityStandardization_Bernabeu.pdf
  - DC25_PAPER_Track13_PathToPCIeGen7Challenges_Pandankerilshaji.pdf
  - DC25_SLIDES_Drive_DegassingHolesInBGAPackage_Occhiali_V2.pdf
  - DC25_PAPER_TRACK13_FreeSignalIntegrityHowUnderstanding _Skytte.pdf
  - DC25_SLIDES_Chiphead_ControllingTheWavesAField_Beeker.pdf
  - DC25_PAPER_Track12_TransmitterPowerSpectralDensityNoise_dePaulis_v2.pdf
  - DC25_PAPER_Track6_DirectToSubstrate200GPAM4_Krooswyk.pdf
  - DC25_PAPER_Track12_ArbitraryWaveformGeneratorAssistedDigitalization _Yuan_V2.pdf
  - DC25_PAPER_Track3_DesignAndPerformanceEvaluationOfA_kang_V3.pdf
  - DC25_PAPER_Track10_ParameterExtractionForBehaviorModel_Zhang.pdf
  - DC25_PAPER_TRACK14_LargeLanguageModelEnabledEngineering_Kumar_V3.pdf
  - DC25_PAPER_Track07_NovelMethodForImprovingDifferential_Bloch_V2.pdf
  - DC25_PAPER_Track14_AcceleratingChipletPlacementAndRouting_HaeyeonKim_V2.pdf
  - DC25_PAPER_Track06_DesignShiftLeftEnablingEarly_Halupka.pdf
  - DC25_PAPER_Track13_ItTakesAVillage224Gbs_Kocsis.pdf
  - DC25_PAPER_Track04_High_Speed_and_High_Density_Shen_V3.pdf
  - DC25_Paper_Track13_DifferentialSkewMitigationTechniqueResults_Kinney_V3.pdf
  - DC25_PAPER_Track12_PerspectivesManagingIntraPairSkew_Kocsis.pdf
  - DC25_PAPER_Track11_MagneticShieldingEffectivenessSimulation_Nguyen_V2.pdf
  - DC25_PAPER_Track10_InSituSystemLevelPDN_Bogatin.pdf
  - DC25_PAPER_TRACK09_400GElectricalPathFinding_CossonMartin.pdf
  - DC25_PAPER_TRACK07_InvestigationOfPinFieldCrosstalk_Luoh_V2.pdf
  - DC25_PAPER_Track07_ExploringCopprLinkAndTheFuture_Kocsis.pdf
  - DC25_PAPER_Track06_112GSignalIntegrityInvestigationImmersion_Kai_FINAL.pdf
  - DC25_PAPER_TRACK02_ModelingGDDR7PAM3DualBranch_Allred1.pdf
  - DC25_SLIDES_Track01_FastDesignAndSimulationOf_Dai_V2.pdf
  - DC25_SLIDES_Drive_SignalIntegrityForAutomotiveMultigigabit_Hardock.pdf
  - DC25_SLIDES_Drive_CommonModeandDifferentialMode_Foelkel_V2.pdf
  - DC25_PAPER_Track5_PSIJBasedIntegratedPowerIntegrity_Shin.pdf
  - DC25_PAPER_Track2_ModelingAndStudyOfNonLinearity _Bhardwaj_Final.pdf
  - DC25_PAPER_Track14_ImpedanceProfilePredictionandClassification_Hassab_V2.pdf
  - DC25_PAPER_TRACK13_ViaDesignFor112GbpsAndBeyond_Manukovsky_V2.pdf
  - DC25_PAPER_TRACK13_InsertionLossOfMechanicallyRoughened_Steinberger.pdf
  - DC25_PAPER_Track13_CascadedPackageToPCBChannel_Peng_v2.pdf
  - DC25_PAPER_Track12_MultiplePulsesBasedDecisionFeedback_Tan.pdf
  - DC25_PAPER_Track11_AdvancingTechnologyHarnessingTransientElectromagnetics _Ahmed.pdf
  - DC25_PAPER_Track10_HighEfficiencyTimingAwarePower_Xiao_V3.pdf
  - DC25_PAPER_Track08_STARTSelfAdaptingToolFor_Unakafov.pdf
  - DC25_PAPER_Track07_IntraPairSkewIn224G_Grant_V2.pdf
  - DC25_PAPER_Track07_AnFMBasedSideChannel_Krotnev.pdf
  - DC25_PAPER_Track05_InnovativeLayoutOptimizationMethodologyVia_Ilamparidhi_V5.pdf
  - DC25_PAPER_TRACK04_StudyOfTDRImpedanceAnd_Tang_V2.pdf
  - DC2025_SLIDES_Track8_200GbpsLanesEqualizationMethods_Zivny_V2.pdf
  - DC25_SLIDES_Drive_LatestProgressOfAdvancedHydrogen_Song.pdf
  - DC25_SLIDES_Chiphead_PanelEnergyEfficientInterfacesFor_Hutchins.pdf
  - DC25_PAPER_Track10_ThermalAnalysisandOptimizedDesign_Bae_V3.pdf
  - DC25_PAPER_Track3_DevelopmentOfACoPackagedApplication_XU_V2.pdf
  - DC25_PAPER_Track10_DeterminingTheRequirementsDievsPackage_Phillips.pdf
  - DC25_PAPER_Track6_IBISAMIModelingBidirectionLink_Rao_V2.pdf
  - DC25_PAPER_Track07_SolvingAKeySignalIntegrity_Liu_V2.pdf
  - DC25_PAPER_Track1_ANovelThermoFlowUniformizerApplied_Son_V2.pdf
  - DC25_PAPER_TRACK07_IntrapairSkewElectricalDelayCompensation_Zhang_V2.pdf
  - DC25_PAPER_Track14_DeepReinforcementLearningBasedDesign_Ryu.pdf
  - DC25_PAPER_Track06_EnhancedApplicationofHigh-SpeedFlexibleMaterialsintheArchitecture_shen_v2.pdf
  - DC25_Paper_TRACK13_ParameterizedCOMAnalysisTool_Pupalaikis.pdf
  - DC25_PAPER_Track05_InnovativeInterposerSolutionsforHBM_Ilamparidhi_V6.pdf
  - DC25_PAPER_TRACK13_DifferentialSkewMitigationTechResults_Kinney.pdf
  - DC25_PAPER_TRACK04_ModelingAndParameterExtractionOf_Jiang.pdf
  - DC25_PAPER_Track12_PracticalImplementationOfInsertionLoss_DiMinico_V3.pdf
  - DC25_PAPER_TRACK01_UsingResponseSurfaceMethodology_Neally_v2.pdf
  - DC25_PAPER_Track12_AccurateAdapterRemovalInHigh_Zhou (1).pdf
  - DC2025_PAPER_Track8_200GbpsLanesEqualizationMethodsRequiredFixtures_Zivny.pdf
  - DC25_PAPER_Track10_NovelMultiPowerDomainPCB_Manoharan_v2.pdf
  - DC25_PAPER_Track09_PostFECBERAnalysisof200Gbs_Barrie_V2.pdf
  - DC25_PAPER_Track07_NextGen224GbpsChiptoChipMR_Wu_V2.pdf
  - DC25_PAPER_TRACK07_GeneticAlgorithmDrivenIBISAMI_Auge.pdf
  - DC25_PAPER_Track06_Beyond200GChallengesTowards400GSystems_Radashkevich_V3.pdf
  - DC25_PAPER_Track04_UseOfThinFilmResistors_Andresakis_V2.pdf
  - DC25_PAPER_TRACK10_BalancingCurrentDensityToHigh_Hostetler.pdf
  - DC25_PAPER_Track07_IBISAMIModelingSimulationDMT_Rao_V6.pdf
  - DC25_PAPER_Track05_CAMMNewStandardMemory_Kocsis.pdf
  - DC25_PAPER_Track01_FastDesignAndSimulation_Dai.pdf
  - DC25_PAPER_Track04_TheInfluenceofCopperCrystal_shen_V2.pdf
  - DC25_PAPAR_Track02_EffectiveContinuousTimeLinearEqualizer_LIU_V3.pdf
  - DC25_PAPER_Track02_FastBERAnalysisTechniquefor_Pang.pdf
  - DC25_PAPER_Track03_NextGeneration224GbpsPAM4Linear_Li_V2.pdf
  - DC25_PAPER_TRACK01_ChipOnBoardAndModified_Khan.pdf

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资源包简介：

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:General400G+Electrical PathfindingJeremy Cosson-。

2、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralFitting Lower Loss into More&Smaller 。

3、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralFlow Model Can Give You Optimal and Divers。

4、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralFree signal integrity?How understanding an。

5、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralAccurate Adapter Removal in High Precisio。

6、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPost-FEC BER Analysis of 200 Gb/s Wirelin。

7、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralOff-Chip Design Method for Improving Signa。

8、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralIBIS-AMI Modeling Formulation for Bi-dire。

9、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralLightning TalksAdvances in Materials&。

10、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralDevelopment of a co-packaged Application 。

11、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralImpedance Profile Prediction and Classif。

12、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInsertion Loss of Mechanically Roughened 。

13、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralMethodology for Accurate Receiver Testing。

14、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralHigh-Efficiency Timing-Aware Power Integri。

15、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralIntra-pair skew in 224G DAC cables,mitiga。

16、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralDirect to Substrate 200G-PAM4 Co-Packaged。

17、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralModeling and Parameter Extraction of 224G。

18、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralModeling and Study of Non-Linearity in Do。

19、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralFoundational Model Approach for SI/PI Anal。

20、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralReduced Order Geometric Macro Model of PC。

21、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInnovative Design of 224G BGAPinmap and 。

22、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralTransmitter Power Spectral Density Noise 。

23、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralAWG-Assisted Digitalization of Physical 。

24、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralA Parameter Extraction Method for Multi-p。

25、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralDetermining the Requirements,Die vs.Packa。

26、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralSTART:Self-Adapting Tool for Automated Re。

27、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralPSIJ Based Integrated Power Integrity Desi。

28、Welcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 How PCB Design Affects Fabrication2Paul CookeDirector of Application EngineeringDirector of Application Engin。

29、Information Classification:GeneralWelcome to Reducing Chips Respin Rate by Fixing Common Decoupling Methods Flaws1ILIYA ZAMEKInformation Classification:GeneralSemiconductor industry losses on chips r。

30、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralDeep Reinforcement Learning Based Design O。

31、1Parameterized COM Analysis Tool For Substrate Routing Impedance StudyTrack 13,Ballroom E Wed,Jan 29,2025,2:00 pm-2:45 pmPete Pupalaikis,Brett SawyerNubis Communications,Inc.2IntroductionSubstrate An。

32、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralCascaded Package to PCB Channel Simulation。

33、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPerspectives on Managing Intra-Pair Skew 。

34、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralTUTORIAL:CHARACTERIZATION OF SHIELDING EF。

35、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralNovel Multi Power Domain PCBDecap Layout 。

36、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPanelOIF Update on 224 Gbps&448 Gbps 。

37、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInvestigation of Pin Field Crosstalk Degr。

38、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralExploring CopprLink&the Future Toward。

39、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralInnovative Layout Optimization Methodology。

40、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralHigh Speed and High-Density Interconnect 。

41、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralEffective Continuous Time Linear Equalizer。

42、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralBalancing Current Density to High-Power A。

43、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:General112G Signal Integrity Investigation for I。

44、Information Classification:GeneralPublicWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPublicStatistical Modeling of Syste。

45、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPATH TO PCIE GEN 7.0:CHALLENGES AND DESIG。

46、Welcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Practical implementation of insertion loss correction and delay characterization of test fixtures used for 20。

47、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralNavigating the Intricacies of Pcie Gen6 E。

48、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPower Delivery Strategies for AI and Data。

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2025第 30 届 DesignCon技术展PPT资料合集（共185套打包）

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