DC25_SLIDES_Track4_BootCampHowPCBDesign_Cooke.pdf

1、Welcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 How PCB Design Affects Fabrication2Paul CookeDirector of Application EngineeringDirector of Application EngineeringAGCAGC (289)991(289)991-17301730www.agcwww.agc-Part 180.004”40:1QUOTATIONPRICE CONSIDERATIONSLo

2、w Cost FactorsComplex routing/ScoringEdge Routing0.093”thick PWBs0.030”thick PWBsVia Plug(button print)High Tg vs low Tg materialBuried CapacitancePRICE CONSIDERATIONSMedium Cost FactorsDrill hole QuantityDrill hole sizeEmbedded resistorsNon-FR4 materialsEdge platingDrilled holes 0.008”PRICE CONSIDE

3、RATIONSCost depends on the fabricators capability and yield calculationHigher Cost FactorsAdvanced TechnologiesDrilled holes 0.004-0.006”Buried ViasLayer CountMaterial UtilizationSelective PlatingLine Width and SpaceCost Trade-offsThe following list presents some general ruleThe following list prese

4、nts some general rule-ofof-thumb tradethumb trade-offs that will provide the most cost offs that will provide the most cost effective higher interconnect density.effective higher interconnect density.Use a smaller line width/space before adding layers Investigate how boards will fit Use a smaller li

5、ne width/space before adding layers Investigate how boards will fit into a production panel to ensure that maximum material utilization occurs.into a production panel to ensure that maximum material utilization occurs.Laser blind Laser blind viasvias before buried before buried viasvias.Smaller hole

6、s before adding layers.Smaller holes before adding layers.Involve your a Field Application Engineer when considering“exotic”dielectrics for Involve your a Field Application Engineer when considering“exotic”dielectrics for high speed,RF designs.high speed,RF designs.PRICE CONSIDERATIONSFabricationInf