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DC25_PAPER_TRACK04_StudyOfTDRImpedanceAnd_Tang_V2.pdf

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1、Information Classification:GeneralStudy of TDR impedance andloss based on modifiedCannonball-Huray roughnessmodel on a 1.6Tbps opticalmodule PCBRongyao Tang,FiberHome TelecommunicationTechnologies Co.,LShengyao Wan,FiberHome TelecommunicationTechnologies Co.,LInformation Classification:GeneralRui Wa

2、ng,Xpeedic Co.,LYinfei Weng,Xpeedic Co.,LZhi Li,Shennan Circuits Co.,LAbstractWith the increasing demand for optical modules driven by 5G communication andartificial intelligence computing,the signal channel from digital signal processing(DSP)chips to optical devices is expected to exceed 130 Gbaud/

3、s,necessitating a 3 dBbandwidth of over 70 GHz.Furthermore,the signal channel from the DSP chip to thegoldfinger will reach 224 Gbps,with a Nyquist frequency surpassing 56 GHz.Accuratelyand rapidly estimating high-frequency losses within this channel presents a significantchallenge.This paper presen

4、ts a case study on the time-domain reflectometry(TDR)impedance andloss of high-frequency transmission lines in 1.6T optical module printed circuit boards(PCBs).Additionally,it proposes an effective surface ratio value for the Cannonball-Huray model,derived from measured surface roughness parameters

5、and appropriatedielectric loss factors(Df)at millimeter-wave frequencies,facilitating the rapid andaccurate estimation of attenuation through the Djordjevic-Sarkar Debye model.Information Classification:GeneralAuthor(s)BiographyRongyao Tang graduated from the Department of Electronics and Science Te

6、chnology(now the School of Optoelectronic Information)at Huazhong University of Science andTechnology,Wuhan,China and began his career at Chinas largest PCB manufacturer,Shennan Circuits Co.,Ltd.,in2011,focusing on the design of high-speed backplanesignal integrity for manufacturing and was awarded

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1. **研究背景**:1.6T光模块信号通道需超70GHz带宽,高频损耗建模挑战大。 2. **材料与工艺**:采用极低损耗PCB材料(如Megtron 8U)、HVLP铜箔及mSAP工艺,线宽缩至30μm。 3. **Dk与Df优化**:使用垂直方向Dk(Dkz)提升阻抗精度(误差从5Ω降至1Ω),通过多频点Df线性拟合改善高频损耗预测。 4. **粗糙度模型**:提出基于Sdr参数的改进Cannonball-Huray模型,验证其在70-100GHz频段对超低轮廓铜箔的适用性(如氧化后Sdr=34.586%)。 5. **验证结果**:2D/3D仿真与实测数据在70-100GHz高度一致,证明模型有效性。
**1.6T PCB损耗建模** **铜箔粗糙度影响** **高频Dk/Df优化**
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