DC25_PAPER_Track13_PathToPCIeGen7Challenges_Pandankerilshaji.pdf

1、 Information Classification:General Path To PCIe Gen 7.0:Challenges And Design Considerations For Next Generation Internal Cabling Ashika Pandankeril Shaji,TE Connectivity Staff System Architect Calvin Feng,TE Connectivity Principal System Architect Nathan Tracy,TE Connectivity Principal System Arch

2、itect Information Classification:General Abstract PCIe has become prominent in the AI and ML market due to its higher bandwidth,low latency,high power,and reliable communication channels,and the ability to handle massive parallel computing needs for AI.To keep up with the demand for bandwidth,there

3、is a compelling need to progress to the next generation of the specification sooner than anticipated,but certainly there are performance challenges to overcome.CopprLink cables allow PCIe technology to stay on the cutting edge of the market demand,so it is important to address these challenges and e

4、volve to the performance expectations of the industry.The paper delves into design improvements at an interconnect level for a near-chip application,signal integrity challenges from PAM4 modulation,ground resonances,and mechanical attributes and reliability.In this paper,we will identify current gen

5、eration challenges in signal integrity and propose design considerations to resolve them to achieve next generation requirements.A comparative simulation-based performance analysis will be presented between the current and next generation internal cabling solution.Author(s)Biography Ashika Pandanker

6、il Shaji is a Staff System Architect at TE Connectivity.She has a strong foundation in electrical and computer engineering from her Bachelors and Masters degrees.She has previously excelled as a Signal Integrity Engineer focused on high-speed applications.Ashikas role at TE Connectivity involves dev