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DC25_PAPER_TRACK13_DifferentialSkewMitigationTechResults_Kinney.pdf

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1、 Information Classification:General Differential Skew Mitigation Technique Results Chris Kinney,Google Vijay Kunda Yi Amy H Luoh Xiaoning Ye,Intel X Information Classification:General Abstract Each differential pair skew mitigation technique has unique performance and cost tradeoffs.For example,imag

2、e rotation results in significant cost adder due to lower panel utilization,while angled routing often results in unnecessary meandering in routing and sometimes not implementable due to limited routing channel.In this paper,a skew mitigation technique that aligns the trace pitch to the underlying g

3、lass fabric fiber-weave pitch is studied.This leads to a differential pitch that is often larger than the typical differential trace pitch found in current platforms.The wider trace pitch also enables wider trace width and thus lower loss.Given high-frequency low-loss printed circuit board transmiss

4、ion lines have limited material property improvement,wider trace width is often a preferred lower-loss option.Delta-L coupons were tested from two PCB fabrication houses with four state-of-art PCB materials.This paper reports on the skew and insertion loss measurement results using standard IPC weav

5、es matched and unmatched on high performance glass.Absolute skew results are less than 2 picoseconds on 5-inch and 10-inch Delta-L coupons,which is about the measurement accuracy of the test equipment.Evidence also indicates that the lines routed in the weft direction are less impacted compared to t

6、he warp direction.Author(s)Biography Chris Kinney is a signal integrity engineer starting 18 years at Google,Intel,Micron and Kioxia.He is currently working on signal integrity challenges with Google Cloud hardware.He has patents and papers on high-density interconnect technology and power delivery.

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1. **技术核心**:通过将差分走线间距与玻璃纤维编织间距对齐,有效抑制差分对内失真(skew),实测失真小于2皮秒(5/10英寸测试板),接近设备测量精度。 2. **性能优势**: wider trace pitch 支持更宽走线,降低插入损耗(如32GHz下85Ω/90Ω阻抗测试),且无需蛇形走线,减少设计复杂性和串扰。 3. **成本效益**:相比旋转面板(节省30%材料),该技术避免面板浪费,但可能需增加高速布线层数;新材料(如K2玻璃)进一步优化损耗。 4. **验证结果**:测试4种先进PCB材料及2家厂商,1035编织方向(weft)失真影响小于warp方向;误用1078编织时失真高达7-8皮秒,验证对齐必要性。
**如何降低PCB信号失真?** **新型PCB材料性能如何?** **高速信号布线技巧有哪些?**
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