DC25_PAPER_Track12_AccurateAdapterRemovalInHigh_Zhou (1).pdf

1、 Accurate adapter removal in high precision RF interconnect characterization Xingling(Mick),Zhou,Samtec Jason Sia,Samtec Tony Chen,Samtec O.J Danzy,Keysight oj_ 2 Abstract This paper addresses the problem of removing the effects of imperfect accessories,such as adapters,in high precision RF intercon

2、nect characterization using vector network analyzers(VNA).We notice that existing methods are either complicated,inaccurate,and or impractical for high end RF project characterization.This paper presents a new process for de-embedding adapters in RF characterization,which is based on the bifurcation

3、 method and some modifications.The process is verified by theoretical considerations,simulation studies in ADS,and six practical examples with various adapter interfaces.The paper also demonstrates that the new process can handle different types of interface adapters such as 1.85 mm,SMPM,N-type,BNC,

4、waveguide,and 1.35 mm.The results correlate well with their respective calibration kits.Xingling(Mick)Zhou Samtec received a PhD in electrical engineering from Arizona State University(ASU)in 2001.He has authorized more than 21 journal and conference publications in EM theory,signal integrity,and se

5、veral USA patents.Mick manages an interconnect design hub and global SI labs at Samtec.Jason Sia Samtec is a signal integrity lab engineer at Samtec with over 5 years of experience in enhancing signal integrity tests through RF and digital connector development projects.He graduated from Pennsylvani

6、a State University with a bachelors degree in electrical engineering in 2019.Tony Chen Samtec Has 12 years of industry experience as an SI engineer and SI LAB engineer having worked at SAMTEC.He received his Master from the National Taipei University of Technology in 2008.Tony works for the SI lab a