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DC25_SLIDES_Track4_FittingLowerLossintoMore_Frankosky_V2.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralFitting Lower Loss into More&Smaller SpacesJack Frankosky,The Chemours Company2Information Classification:GeneralImageSPEAKERSJack FrankoskyAp

2、plications Development Principal Engineer,The Chemours Company Jack.F| twitterPrior to joining Chemours,Jack has had a variety of roles with Arlon,LLC,W.L.Gore&Associates,Rogers Corporation and the DuPont Company.He lives near Kennett Square,Pennsylvania with his wife and some of their children.He t

3、ries to get outdoors to go biking,hiking and whitewater kayaking.3Information Classification:GeneralFitting Lower Loss into More&Smaller SpacesAGENDA Chemours Introduction Technical Challenges Selection of Building Blocks Characterization of Composite Dielectric Properties Practical Example Comparis

4、ons in PCB Summary4Information Classification:GeneralADVANCED PERFORMANCE MATERIALSTHERMAL&SPECIALIZED SOLUTIONSTITANIUM TECHNOLOGIES5Who are The Chemours Company?Information Classification:GeneralWe invest in responsible chemistry that meets todays needs while providing a better future for all.Our

5、Corporate Responsibility CommitmentCorporate Responsibility CommitmentWe announced 10 bold goals in 2018 to bring responsible chemistry to life by 2030.Bold Emission Goals We aim to achieve net-zero Greenhouse Gas Emissions(GHGs)by 2050,with an interim target of 60%absolute reduction of operations-r

6、elated GHGs by 2030.Leading by ExampleCommitted to 50%of our revenue coming from products that positively impact UN Sustainable Development Goals.6Information Classification:GeneralGrowing Demand in High Speed Data,High Frequency Signal Transmission Impact of Low Dk on signal transmission,design fle

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1. **会议与公司背景**:2025年1月28-30日于圣克拉拉会议中心举办,Chemours公司致力于负责任化学,目标2050年实现净零温室气体排放。 2. **技术挑战**:高频信号传输需降低介电常数(Dk≤1.5)和损耗(tan δ≤0.0004),同时确保高温耐受性(>288°C)与导体粘合强度(>0.7 N/mm)。 3. **材料特性**:氟聚合物(如PFA)实现低Dk(2.27@140GHz)和低损耗,支持熔融加工与铜箔粘合,兼容HVLP5无结节铜箔(Rz≈1.0μm)。 4. **性能优势**:低Dk设计可减少插入损失>0.1dB/英寸,降低层高35%,D频段(140GHz)辐射效率达98.6%(对比参考值90.8%)。 5. **应用与工艺**:支持连续层压、激光钻孔及增材金属化,适配标准与先进PCB加工,粘合强度>1.0 N/mm。
**低损耗材料优势?** **高频信号如何优化?** **铜箔选择影响?**
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