DC25_SLIDES_TRACK01_ChipOnBoardAndModifiedSAP_Khan_V2.pdf

1、5GChip-On-Board&Modified-SAP Design for the 100G PAM4&Beyond Active Cable&Optical TransceiversRehan Khan1/28/2025BackgroundThe need for advanced cabling solutions capable of supporting high-speed data transmission with minimal latency and power consumption.800G technology represents a significant le

2、ap in networking and data center infrastructure.This advancement is distinguished by the introduction of a bare die or Known Good Die(KGD)retimer.PKG Paddle Card Simulation Host side:RX1-RX6 PCB Material:Megtron 7,Dk=3.3 and Df=0.0015 at 1 GHz.PKG Paddle Card Simulation Results_Host Side W a n d t e

3、 c C o n f i d e n t i a l,u n d e r N D A o n l yPKG Paddle Card Simulation Line Side:TX1-TX3;RX6-RX8 W a n d t e c C o n f i d e n t i a l,u n d e r N D A o n l yPKG Paddle Card Simulation Results_Line Side PKG Power Device Thermal Simulation ItemMaterialPower/Thermal conductivityU2(DC-DC)Silicon0

4、.8WU3(DC-DC)Silicon0.03WU4(DC-DC)Silicon0.02WU13(DC-DC)Silicon0.02WU14(DC-DC)Silicon0.01WU8(DSP)Silicon9.7WU5(MCU)Silicon0.5WThermal PasteProlimatech PK-3Thermal conductivity 11.2W/(m.k)HOUSING BASEZAMAK3Thermal conductivity 113.3W/(m.k)HOUSING COVERZAMAK3Thermal conductivity 113.3W/(m.k)Thermal Dis

5、sipation Simulation with Thermal Paste OnlyThermal Dissipation Simulation with Thermal Paste and Copper PlatePKG Thermal Simulation ResultsWith thermal paste only:TDSP=88.2CWith thermal paste and copper plate:TDSP=84.9CKGD Paddle Card Simulation Host side:RX1-RX6 Simulation KGD vs PKG_Host SideKGD I

6、L vs PKG ILKGD ILKGD RL KGD RL vs PKG RL Simulation KGD vs PKG_Host SideRX3-RX4 NEXT and RX2-RX4 FEXTSimulation KGD vs PKG_Host SideKGD Paddle Card Simulation_Line SideLine side:RX1-RX6 KGD ILKGD IL vs PKG ILSimulation KGD vs PKG_Line SideSimulation KGD vs PKG