DC25_SLIDES_Track02_FastBERAnalysisTechniquefor_Pang.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralFast BER Analysis Technique for Next Generation Chiplet Simultaneous Bi-Directional TransceiverSpeaker:Tu Gong,Julin Technology Co.,Ltd.Authors

2、:Tingting Pang,T-Head Semiconductor Co.,Ltd.Yanbin Chen,T-Head Semiconductor Co.,Ltd.Jialong Dong,Julin Technology Co.,Ltd.2Information Classification:GeneralImageSPEAKERTu Gong SI Engineer&Field Application Engineer,Julin Technology Co.,Ltd.tugongjulin-He received his B.S.and M.S.from the Universit

3、y of Sheffield,UK,and NanyangTechnological University,Singapore in 2022,2023 respectively.He began hiscareer at Julin as a Signal Integrity Engineer in 2023.Currently,he works as aField Application Engineer,supporting sales to drive more purchase orders.3Information Classification:GeneralAuthorsTing

4、ting PangSI Engineer,T-Head Semiconductor Co.,Ltd.pangtingting.pttalibaba-SheisworkingonDDR/D2Dmodeling,simulation and validation.Her areas of interestare system-level signal/power integrity and high-speed transceiver design.He graduated from the university of science andtechnology of China,Hefei,Ch

5、ina.He joinedJulin Technology Co.,Ltd.as a signal integrityengineer since 2022,and his interest is system-level SI/PI analysis,simulation and modelingmethodologies.4Yanbin ChenHeisresponsibleforadvancedpackagedesign,DDR/D2Dsystemperformancedevelopment,andsimulation methodology/validation.He received

6、 his B.S.and M.S.from East China Normal University,in 2005,2008 respectively.SI Engineer,T-Head Semiconductor Co.,Ltd.maozhao.cybalibaba-JiaLong DongSI Engineer,Julin Technology Co.,Ltd.jialongdongjulin-Information Classification:GeneralBackground5 Demand for high bandwidth Die-to-Die(D2D)interface