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DC25_PAPER_Track07_ExploringCopprLinkAndTheFuture_Kocsis.pdf

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1、 Information Classification:General Exploring CopprLink&the Future Towards Electro-Optical Interconnects for Evolving Rack Architectures in Data Centers Sam Kocsis,Amphenol Mike Klempa,Alphawave Semi Dave Kulansky,Alphawave Semi Information Classification:General Abstract Today nearly two-thirds of

2、data center traffic occurs within a given rack.Inside that rack,complex server platforms carry out processor,accelerator,memory/storage,and networking functions.As rack architecture evolves and disaggregate these network elements into composable resources to make more efficient use of the hardware a

3、vailable,there becomes aa greater need for more interconnects.The PCI-SIG announced the CopprLink specification this year and created the opportunity for platform designers to develop new architectures that take advantage of the extended physical reach and new spacing constraints that cabling soluti

4、ons offer.CopprLink is a specification based on passive copper interconnects,but it does leave the door open for complementary optical PCIe solutions.This paper will explore the topological options created by CopprLink in the context of compliant PCIe links.The recent PCIe 6.0 and 7.0 performance ta

5、rgets help evaluate the types of cabling solutions that can be used,along with when and how the transition to optical solutions is likely to occur.Beyond theoretical topology studies,this effort will dive-deep into the performance capabilities of SFF-TA-1016 and SFF-TA-1032 solutions,which have been

6、 adopted by PCI-SIG as the standard interface for CopprLink.A special focus will be placed on key characteristics of nominal impedance,integrated return loss(iRL),component contribution integrated crosstalk noise(ccICN),and effective intra-pair skew(EIPS).Silicon capabilities will be evaluated in th

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1. **背景与需求**:数据中心机架内流量占比近2/3,随着架构解耦(如AI/ML集群、CXL 3.0),PCIe互连需求激增,市场预期解构内存(1.5x NVMe市场)和网络加速器(4-5x NVMe市场)机会显著。 2. **CopprLink规范**:PCI-SIG 2024年推出基于无源铜缆的CopprLink(SFF-TA-1016/1032接口),支持PCIe 5.0/6.0/7.0,目标内部链路1m、外部2m,插入损耗预算14dB@16GHz(64GT/s)。 3. **性能与挑战**:铜缆需跨代兼容(如85Ω阻抗匹配),DSP SerDes可提升眼高/眼宽(如1.75m链路BER达标),但外部铜缆在128GT/s时 reach 降至1m,需光学方案延伸。 4. **光学过渡**:PCIe 7.0+可能转向光学(如CEM AIC模块),拓扑分T1(retimer内置模块)和T2(retimer外置),目标10m reach,需平衡功耗、延迟与互操作性。
**CopprLink如何革新?** **铜缆与光缆如何协同?** **PCIe未来何去何从?**
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