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DC25_PAPER_TRACK09_400GElectricalPathFinding_CossonMartin.pdf

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1、 Information Classification:General 400G+Electrical Pathfinding Jeremy Cosson-Martin,AMD,jeremy.cosson- Kevin Zheng,AMD, Shiva Kiran,AMD, Athanasios Ramkaj,AMD, Ronan Casey,AMD, Hongtao Zhang,AMD, Jay Im,AMD, Yohan Frans,AMD, Geoff(Geoffrey)Zhang,AMD, Information Classification:General Abstract This

2、 paper proposes filter-bank multi-carrier(FBMC)modulation as a promising alternative to PAM4,6,8,12,16 and discrete multi-tone(DMT)for next-generation 400Gb/s+per lane long-reach electrical interconnect.An extensive pathfinding investigation is performed to compare the seven options.PAM6,PAM8,and FB

3、MC are identified as likely candidates,with FBMC showing high resilience to many typical impairments.Moreover,the TX DAC,RX ADC,and DSP design assumptions are only slightly elevated over current 200Gb/s interconnect.Author(s)Biography Jeremy Cosson-Martin received his Ph.D.degree in Electrical Engin

4、eering from the University of Toronto,ON,Canada,in 2023.His research focused on advanced high-speed wireline modulation schemes.Currently,he works as a Member of Technical Staff Silicon Design Engineer at AMD developing next-generation high-speed wireline transceivers.He also serves on the Solid-Sta

5、te Circuits Society(SSCS)education committee and is the program chair of the SSCS Arduino Contest.Kevin Zheng received his Ph.D.degree in Electrical Engineering from Stanford University in 2018.He is currently a Principal Engineer at AMD,San Jose,CA working on ultra high-speed electrical and optical

6、 interconnects.Dr.Zheng received the J.Francis Reintjes Excellence in VI-A Industrial Practice Award,the David Adler Memorial EE M.Eng.Thesis Award in 2013,and Best Paper Award for DesignCon 2019.His current interests involve link modeling,high speed circuit designs and communication algorithms.Shiv

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1. **研究目标**:为400Gb/s+长距离电互连寻找替代PAM4/6/8/12/16和DMT的调制方案,评估FBMC的潜力。 2. **候选方案**:通过路径探索,PAM6、PAM8和FBMC被确定为可行候选,其TX DAC、RX ADC和DSP设计要求仅略高于200Gb/s标准(1e-4 BER)。 3. **FBMC优势**:FBMC对典型损伤(如频率凹陷、高插入损耗偏差)的鲁棒性显著优于PAM,能自适应分配信号功率至高SNR频段,且串扰抑制能力更强(不到PAM的一半)。 4. **性能对比**:仿真显示,在非理想信道(如200%频率缩放或10dB/20dB凹陷)下,FBMC的BER劣化远低于PAM6/8,且对抖动的敏感性更低。 5. **结论**:FBMC是极具前景的下一代400Gb/s+电互连候选方案,尤其在复杂信道中表现突出。
**FBMC优势何在?** **400G+调制方案?** **PAM vs FBMC对比?**
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