DC25_SLIDES_Track05_InnovativeInterposerSolutionsforHBM_Ilamparidhi_V4.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralInnovative Interposer Solutions for HBM3/4:A path to 12.8GbpsIlamparidhi I,(Alphawave Semi)Suriya Prakash T(Alphawave Semi)Gangaraju M(Alphawav

2、e Semi)Yadavalli Jagadeeswari(Alphawave Semi)Diksha Acharya(Alphawave Semi)2Information Classification:GeneralImageSpeaker&AuthorIlamparidhi IPrincipal SI-PI Engineer,Alphawave S3Ilamparidhi I is a Principal SI-PI Engineer at Alphawave Semi with over 19 years of industry expertise in AnalogMixed Sig

3、nal(AMS)System Modelling&Optimization,Advanced Package Design&Optimization,and PCB design.He leads a technical team focused on developing next-generation Die to Die solutions for UCIe and HBM interfaces.He holds an MTech in Microwave and Photonics from the Indian Institute of Technology,Kanpur(IIT-K

4、),and hasworked with leading companies such as Cisco,Seagate,Rambus,Xilinx,and Freescale Semiconductor.In the pastyear,he has driven key innovations at Alphawave Semi,resulting in the filing of 4 US patents(pending approval)related to Advanced package design and Analog Mixed Signal(AMS)system for hi

5、gh-performance HBM and UCIetechnologies.Information Classification:GeneralImageCo-AuthorsSuriya Prakash TGangaraju MGangarajuMisanAdvancedPackageDesignEngineeratAlphawaveSemiwith3+yearsofexpertise in HBM and UCIe.He specializes in layout,3DEM extraction,and innovationsin advancedpackaging,with one U

6、S patent(pending approval).4Yadavalli JagadeeswariYadavalli.JYadavalli Jagadeeswari is an Advanced PackageDesign Engineer at Alphawave Semi with 3+yearsof expertise in HBM and UCIe.She specializes inlayout,3DEMextraction,andinnovationsinadvanced packaging,with one US patent(pendingapproval),and is p