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DC25_SLIDES_Track13 Beyond200GBrickwallsOf400G_dePaulis.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralBeyond 200G:Brick Walls of 400G links per LaneAndrew Josephson,(Samtec)Rick Rabinovich,(Keysight)Brandon Gore1,Richard Mellitz1,Andrew Josephs

2、on1Francesco de Paulis2,Luis Boluna3,John Calvin3,Rick Rabinovich3,Mike Resso3Francesco de Paulis2,Luis Boluna3,John Calvin3,Rick Rabinovich3,Mike Resso32Information Classification:GeneralImageImage SPEAKERSAndrew JosephsonTechnologist,SFocusing on emerging data rate interface technology development

3、,maturation and standardization.Andrew was previously Distinguished Member of the Technical Staff at General Dynamics where he contributed to mission critical embedded computing solutions for HPC systems and airborne platforms.He has worked on electromagnetic environmental effects(E3)and RF radiatio

4、n hazard analysis,modelling and site surveying spectrum on warships.Rick RabinovichDistinguished Engineer,Keysight TSpecialized in 3D modeling of electromagnetic structures and PCB stack-up optimization.Ricks previous positions include Distinguished Member of the Technical Staff at Alcatel-Lucent/Be

5、ll Labs,Fellow Associate at Spirent Communications,and senior position at Northrop.IEEE802.3TM Ethernet contributor and voter member for 23 years.3Information Classification:GeneralAgenda4Background PhysicsQuarter Wave Stubs,Emitters,Slots and Higher Order ModesInterconnect Feature SizeShrinking wav

6、elength scale and UIPut in context of C2M interface for Switch to front panel pluggable channel topologyApply radiation physics concepts to PCB interconnect scale features at 80GHz for 400G signaling spectrums of interest.Ask PCB features radiation questions instead of SI interconnect onesListen for

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1. **物理基础与互连挑战**:400G信号(>80GHz)下,PCB特征尺寸(如λ/4 stub、via antipads)接近波长,导致寄生辐射、驻波和模式共振,成为性能瓶颈(如S11/S21恶化)。 2. **辐射物理影响**:PCB走线(如250um宽)在80GHz可等效为半波偶极子(增益2.45dBi),via槽缝辐射功率达-80dBm,需通过地笼抑制(但仍有泄漏)。 3. **拓扑限制**:传统C2M接口(如QSFP pad stub)因阻抗不连续性限制带宽,PCB损耗随线宽减小而增加(如50um线@80GHz损耗达-1.65dB/inch)。 4. **解决方案**:共封装Twinax C2C拓扑可消除3个关键反射问题区域,缩短互连长度(如250mm铜缆),避免PCB辐射限制。
**400G信号瓶颈?** **PCB辐射如何影响?** **C2M拓扑如何优化?**
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