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DC25_SLIDES_TRACK09_PanelOIFUpdateOn224G_Tracy.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPanelOIF Update on 224 Gbps&448 Gbps Common Electrical I/O(CEI)DevelopmentsNathan Tracy,TE ConnectivitySrinivas Venkataraman,MetaCathy Liu,Bro

2、adcom Inc.Mike Li,IntelJohn Calvin,Keysight2January 29,2025OIF Update on 224 Gbps&448 Gbps OIF Update on 224 Gbps&448 Gbps Common Electrical I/O(CEI)DevelopmentsCommon Electrical I/O(CEI)Developments3January 29,2025Nathan Tracy,TE ConnectivitySrinivas Venkataraman,MetaCathy Liu,Broadcom Inc.Mike Li,

3、IntelJohn Calvin,KeysightOIF-Where the optical networking industrys interoperability work gets done 4What:Identify needs,gapsDevelop interoperable optical,electrical,and control solutionsPublish Implementation AgreementsWho:150+member companiesNetwork operatorsSystem vendorsComponent vendorsTest&mea

4、surement vendorsAcademia&research Why:Accelerate adoption of advanced technology to connect a global,open networked worldChallenge:Support innovation while preserving interoperability,optimizing performance and cost5OIF:How Work Gets DoneMarket Awareness and Education CommitteeTechnical CommitteeInt

5、eroperability DemonstrationsImplementation AgreementsImplementation AgreementsNetworking&Operations WGInteroperabilityWGPhysical&Link Layer WGPhysical Layer User GroupNetwork Operator WG network operators system vendors component vendors test eqt vendorsNetwork and Cloud OperatorsSystem Developers E

6、nergy Efficient Electrical Management Optical ProtocolNetwork Control and Operation ProjectsInputsInputsInputsInputs6OIF CEI(Common Electrical IO)Electrical Implementation OIF CEI(Common Electrical IO)Electrical Implementation Agreements Agreements The Common Electrical IO(CEI)Implementation Agreeme

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1. **会议与主题**:2025年1月28-30日于圣克拉拉会议中心举办,聚焦OIF(光互联论坛)224Gbps/448Gbps CEI(通用电气接口)发展。 2. **技术进展**: - CEI-112G已成熟(112Gbps,2024年),应用于IEEE、InfiniBand等标准。 - CEI-224G项目启动,定义MR(芯片间)、XSR(芯片到近封装光学)、VSR(芯片到模块)、LR(背板)等通道,支持144-232Gbps PAM4,目标BER≤5×10⁻⁶。 - CEI-448G框架已获批(2024年8月),探索PAM4/PAM6调制,挑战包括通道损耗(>40dB@112GHz)和串扰。 3. **行业挑战**:448Gbps需更高阶调制(如PAM8)、先进封装(≤0.5mm球间距)及新型连接器设计,以应对带宽与信号完整性问题。 4. **生态协作**:OIF联合150+成员(Meta、Intel、Broadcom等)推动互操作性,加速AI/高密度网络应用。
448G何时商用? 224G有何突破? PAM8能行吗?
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