当前位置:首页 > 报告详情

DC25_SLIDES_Track07_InvestigationOfPinFieldCrosstalk_Luoh_V2.pdf

上传人: S** 编号:1240871 2026-05-16 29页 2.05MB

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInvestigation of Pin Field Crosstalk Degradation due to PCB Manufacturing VariationAmy Luoh,(Intel)Amy Luoh(Intel),Xiaoning Ye(Intel),Vijay Ku

2、nda(Intel),Chenghai Yan(Intel),Kuan-Yu Chen(Intel)2Information Classification:GeneralSPEAKERSAmy LuohTech Lead,IAmy Luoh is currently a Technical Lead at Intel Corporation.She received the B.S.and M.S.degree in electrical and computer engineering from Oregon State University.She has been working as

3、a signal integrity engineer in server group at Intel since 2005.She leads test board designs,performs routing reviews,PCB material studies and signal integrity and power integrity related simulations and measurements for the server board designs.3Information Classification:GeneralAuthorsVijay KundaS

4、ignal Integrity Engineer,IVijay Kunda works as Signal Integrity Engineer within DCAI Intel Corporation.Vijays primary focus is to lead,simulate,review platforms with an emphasis on high speed and low speed designs.He is also involved in a lot of pathfinding work such as loss/crosstalk analysis and o

5、ptimized stack-ups.Prior to Intel,Vijay was with Oracle for over 10 years specializing in high speed pre and post layout full board DDR2/3/4 simulations and high-speed serial interconnects simulations.He received his MS in Electrical Engineering from the University of South Carolina specializing in

6、Antenna Design.Xiaoning YeSr.Principial Engineer,IXiaoning Ye is currently a Sr.Principal Engineer at Intel Corporation,working on signal integrity of high-speed interconnects in Server systems.He received his Bachelor and Masters degrees in electronics engineering from Tsinghua University,Beijing,C

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **研究背景**:数据中心高速设计因PCB制造变异(如层间错位、钻孔偏差)导致引脚串扰(FEXT)显著恶化,实测值(同层4-5mV,邻层8-12mV)远超初始仿真(1.9mV/4.5mV)。 2. **关键影响因素**: - **反焊盘尺寸**:直径从26mil增至32mil,串扰激增300%; - **差分对错位**:单侧偏移1mil,串扰增加50%; - **反焊盘数量/位置**:减少反焊盘可降低串扰(最高74%),但非线性关系。 3. **解决方案**: - 优化反焊盘尺寸(最小化)并远离布线(3-4mil); - 缩短 breakout 长度; - 结合3D X射线实测数据更新仿真,实现与测量结果高度一致。 4. **结论**:制造变异是串扰主因,需在设计阶段纳入容差分析。
**PCB制造如何影响串扰?** **如何优化高速布线设计?** **3D X-ray如何验证信号完整性?**
客服
商务合作
小程序
服务号
折叠