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DC25_SLIDES_TRACK13_InsertionLossOfMechanicallyRoughened_Steinberger.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInsertion Loss of Mechanically Roughened ConductorsMichael Steinberger,(MathWorks)Orlando Bell,(GigaTest Labs)Michael Tsuk(MathWorks)2Informat

2、ion Classification:GeneralImageImage SPEAKERSMichael SteinbergerConsulting Software Engineer,MathW|Michael has over 30 years of experience designing very high-speed electronic circuits.Dr.Steinberger holds a Ph.D.from the University of Southern California and has been awarded 14 patents.He was Desig

3、nCon 2015s Engineer of the Year.He is currently responsible for the behavioral modeling of mixed analog and digital circuits.Before joining MathWorks,Dr.Steinberger was the lead architect for high-speed serial channel analysis at SiSoft.Orlando BellVP of Engineering,GigaTest L|Orlandos key responsib

4、ilities include managing the high-frequency characterization lab and driving the research and development of advanced test hardware for the Signal Integrity market.He holds a BSEE and MSEE from the University of Florida in Gainesville,Florida.3Information Classification:General Background Test Struc

5、tureoFabrication ProcessoMechanical Structure MeasurementsoLow Frequency DataoHigh Frequency Data Measurement Impairment De-Embedding Conductor Roughness Calculations Conclusions and RecommendationsAgenda:Roughened Conductor Insertion Loss4Information Classification:General5Sources of Transmission L

6、ine LossConductorDielectricRamo,Whinnery and Van Duzer,Fields and Waves in Communications Electronics,Third Edition,Section 6.4 Waves in Imperfect Dielectrics and Conductors,John Wiley&Sons,Inc.,copyright 1994.=+=1+2=1 382+2Skin ResistanceDielectric LossSkin InductancePCB transmission lines typicall

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1. **研究主题**:机械粗糙化导体(如轧制铜)的插入损耗影响,聚焦于PCB传输线损耗来源。 2. **核心发现**:测试导体插入损耗约为光滑铜导体的两倍,主因是未退火轧制工艺(非表面粗糙度或损耗介质涂层)。 3. **关键数据**: - 测试结构:带状线,导体厚0.45mm、宽3mm,长度0.61m,介电常数2.0。 - 测量频率:30kHz–40GHz,低频数据(30kHz)趋肤深度(0.21mm)接近导体厚度。 4. **结论与建议**: - 超出趋肤效应和介质损耗的插入损耗主要源于导体-介质界面的损耗性化学物质。 - 建议:使用退火轧制铜箔,与PCB供应商管控化学物质,测试不同化学组合的影响。
粗导体损耗之谜? PCB损耗主因何在? 铜箔工艺如何选?
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