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DC25_SLIDES_Track07_ExploringCopprLinkAndTheFuture_Kocsis.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralExploring CopprLink&the Future Towards Electro-Optical Interconnects for Evolving Rack Architectures in Data CentersSam Kocsis(Amphenol)Speake

2、r 2,(Company)Paper Author 1(Company),Paper Author 2(Company)Paper Author 3(Company)2Information Classification:GeneralImageSPEAKERSSam KocsisDirector of Standards and Technology,AmphenolSam Kocsis currently holds the role of Director of Standards and Technology at Amphenol,focusing on the proliferat

3、ion of innovative interconnect solutions.Sam coordinates Amphenols engagement strategies in various industry standards and consortiums across networking,server/storage,optics,and commercial markets.He is active in IEEE 802.3,and OCP projects,and currently serves as the Technical Committee Vice Chair

4、 at the OIF,is Co-Chair of the OSFP MSA and the Chairman of the PCI-SIG Cabling Workgroup.Sam holds BSEE and MSEE degrees from the University of Rochester,in Rochester,New York.3Information Classification:GeneralImageSPEAKERSDavid KulanskyDirector,Alphawave SemiDave Kulansky is a Director at Alphawa

5、ve Semi focused on High-Speed IO.Dave has over 20 years of semiconductor experience,focused on best fit solutions to streamline development.Before joining Alphawave,Dave held positions in AMS&SerDes design,but he most recently focused on PCIe&Ethernet solutions.Dave holds engineering degrees from Pr

6、inceton University&Johns Hopkins University.4Information Classification:GeneralImageSPEAKERSMichael KlempaStaff Engineer,Alphawave SemiMike Klempa is a Staff Engineer at Alphawave Semi for high-speed applications.He is currently serving as the Optical Interconnect Forums(OIF)Interoperability Physica

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1. **会议与主题**:2025年1月28-30日圣克拉拉会议中心,聚焦数据中心机架架构的电光互连未来,探讨CopprLink与PCIe线缆技术。 2. **核心数据**:PCIe 6.0模拟信道显示,1.25米线缆损耗达5dB,系统总损耗6dB;PCIe 7.0目标128GT/s,需突破铜缆性能瓶颈。 3. **技术挑战**:铜缆预算受限,需DSP SerDes支持无中继器长距离传输;光学互连需解决非线性问题,未来可能转向OBO/CPO架构。 4. **市场趋势**:PCIe作为计算互连骨干,线缆需求增长,混合部署(铜+光)将成为PCIe 7.0及以后的主流方向。
**PCIe未来?** **铜缆极限?** **光学互联?**
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