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DC25_SLIDES_Track4_ModelingAndParameterExtractionOf_Jiang-V2.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralModeling and Parameter Extraction of 224G PCB Under Variable Temperature and Research on The Influence of Temperature on SIXiuguo Jiang(Keysig

2、ht)Xiuguo Jiang(Keysight),Yao Tang(Founder PCB),Changjun Zhang(Hisuntest),Cindy Cui(Keysight),Feng Wang(Founder PCB),Yali Gao(Founder PCB),Yang Yang(Founder PCB),Gongxian Jia(Molex),Qian Deng(Molex)2Information Classification:GeneralImage SPEAKERSCindy CuiKeysightCindy_CCindy Cui received her Master

3、s degree in Micro-Electronics from Tianjin University.She has 15+years of EDA industry experience,specializing in RFMW design,Memory,SerDes,and Device Modeling.She has published several technical papers at DesignCon.She currently serving as the SE Director of the EDA team at Keysight Technology.3Ima

4、ge Xiuguo JiangKXiuguo Jiang is the Manager of Great China EAD SE&CSM of Keysight Technologies,where he focuses on SI,PI,and EMC.He has more than 14 years of experience in Hardware and SI,and published over 5 books on SI,PI,and EE.Information Classification:GeneralSPEAKERSChangjun ZhangHiSuntestchan

5、gjun-Changjun Zhang is the technical director of Hisuntest,supporting high-speed interconnect measurement and modeling,and dielectric material characterization.He has been engaged in signal integrity simulation and measurement for more than 20 years.4Yao TangFounder PCBYuuta.TYao Tang got his PhD fr

6、om the UESTC and worked in Zhuhai Founder Technology High-Density Electronics Co.Ltd.as a technical expert for 8 years.Experienced in printed circuit materials,high-speed signal integrity and new process development of PCB,had a long-term cooperation with customers front-end to develop new technolog

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1. **研究背景**:针对AI服务器224Gbps高速链路(如Ethernet、PCIe等)的信号完整性(SI)问题,分析温度对PCB传输线损耗的影响。 2. **核心数据**: - 温度从30°C升至150°C时,PCB插入损耗增加约0.2dB/in(如Layer 9:1.014→1.246dB/in)。 - 介电常数(Dk)和损耗因子(Df)随温度升高而增大,导致眼图劣化。 - 链路损耗(如16英寸)从30°C的39.745dB升至150°C的41.594dB,可能引发系统误码率(BER)增加。 3. **结论**:需建立温度相关的PCB模型,确保高速链路设计余量,并扩展至封装、连接器等组件的建模。
**温度如何影响信号?** **224Gbps的损耗极限?** **PCB材料模型如何建立?**
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