DC25_PAPER_TRACK04_ModelingAndParameterExtractionOf_Jiang.pdf

1、 Information Classification:General Modeling and Parameter Extraction of 224G PCB Under Variable Temperature and Research on The Influence of Temperature on SI Xiuguo Jiang,Keysight Yao Tang,Founder PCB Yuuta.T Changjun Zhang,HiSuntest changjun- Cindy Cui,Keysight Cindy_ Feng Wang,Founder PCB Jed.W

2、Yali Gao,Founder PCB Catherine.G Yang Yang,Founder PCB Leo.Y Gongxian,Jia,Molex G Qian Deng,Molex Information Classification:General Abstract In the routers and switches of data centers,the high-speed data signal on the PCB has reached a rate of 200+Gbps.Due to the high system power consumption and

3、large amount of heat generated,the temperature on the packaging substrate or PCB main board has exceeded 90 degrees or more.Under high temperatures,the dielectric constant and loss tangent of the PCB usually change,altering the impedance and loss of the transmission line and reducing the design marg

4、in of the system.In addition,in a high-temperature environment,it may affect the skew of differential signals and crosstalk.Based on measuring the S parameters of the PCB and the Dk/Df of the board material under variable temperatures,this paper conducts parameter extraction and modeling for the die

5、lectric constant and copper foil.By simulating and measuring to analyze the impact of temperature on the dielectric constant,dielectric loss angle,skew,crosstalk,eye diagram,and COM,and through comparing the actual measurement and SI analysis of several test boards made by different high-speed diele

6、ctric material,good results are obtained,providing a good reference and guidance for the future mass production of 224G and even 448G.Author(s)Biography Xiuguo Jiang is the Manager of Great China EAD SE&CSM of Keysight Technologies,where he focuses on SI,PI,and EMC.He has more than 15 years of exper