DC25_SLIDES_Track1_ANovelThermoFlowUniformizerApplied_Son.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralA Novel ThermoFlow Uniformizer applied Immersion Cooling System(TFU-ICS)for Highly-Dense Multi-GPU-HBM Based Compute Module for AI Supercompute

2、rKeeyoung Son(KAIST)2Information Classification:GeneralSPEAKERS3Keeyoung SonPh.D.,KAISTKeeyoung Son received the B.S.degree in mechanical engineering from the Korea advanced Institute of Science and Technology(KAIST),South Korea,in 2019.and the M.S.and Ph.D.degrees in electrical engineering from the

3、 KAIST,in 2021 and 2025,respectively.He has research experience about six years in the field of signal/power integrity(SI/PI)for high-speed interconnects and thermal effects on SI/PI.His professional experience includes serving as an HDMI consultant at Analog Devices and working as an RFIC EM team i

4、ntern at Qualcomm in San Diego.His current research focuses on the design and analysis of SI/PI in electronic packaging systems.https:/ Classification:General Introduction Proposal of ThermoFlow Uniformizer applied Immersion Cooling System(TFU-ICS)Thermal Evaluation of TFU-ICS for Multi-GPU-HBM base

5、d Highly Dense Compute Module Temperature-dependent Signal Integrity Evaluation of Compute Module with TFU-ICS Conclusion4OutlineInformation Classification:GeneralMulti-GPU-HBM based AI Supercomputer and Thermal Management Issues5Thermal issue from dense design ofCompute moduleRackInformation Classi

6、fication:GeneralNecessity of Powerful and Uniform Cooling System for Multi-GPU-HBM based Compute Module6Information Classification:GeneralHeat Sink Development with Increased Power Consumption7 As power consumption of system has increased,heat sink developed for high cooling performance.For thermal