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DC25_SLIDES_Track05_InnovativeLayoutOptimizationMethodologyVia_Ilamparidhi_V2.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralInnovative Layout Optimization Methodology and Via Routing Pattern to Enable UCIe 36Gbps in Organic InterposerIlamparidhi I,(Alphawave Semi)Sur

2、iya Prakash T(Alphawave Semi)Yadavalli Jagadeeswari(Alphawave Semi)2Information Classification:GeneralImageSpeaker&AuthorIlamparidhi IPrincipal SI-PI Engineer,Alphawave S3Ilamparidhi I is a Principal SI-PI Engineer at Alphawave Semi with over 19 years of industry expertise in AnalogMixed Signal(AMS)

3、System Modelling&Optimization,Advanced Package Design&Optimization,and PCB design.He leads a technical team focused on developing next-generation Die to Die solutions for UCIe and HBM interfaces.He holds an MTech in Microwave and Photonics from the Indian Institute of Technology,Kanpur(IIT-K),and ha

4、sworked with leading companies such as Cisco,Seagate,Rambus,Xilinx,and Freescale Semiconductor.In the pastyear,he has driven key innovations at Alphawave Semi,resulting in the filing of 4 US patents(pending approval)related to Advanced package design and Analog Mixed Signal(AMS)system for high-perfo

5、rmance HBM and UCIetechnologies.Information Classification:GeneralImageCo-AuthorsSuriya Prakash T4Yadavalli JagadeeswariYadavalli.JYadavalli Jagadeeswari is an Advanced PackageDesign Engineer at Alphawave Semi with 3+yearsof expertise in HBM and UCIe.She specializes inlayout,3DEMextraction,andinnova

6、tionsinadvanced packaging,with one US patent(pendingapproval),and is pursuing an MTech at the IndianInstitute of Technology,Madras(IIT Madras).Suriya Prakash T is a Senior SI-PI Engineer atAlphawave Semi with 8+years of expertise in IP,advanced packaging,and PCB design.He specializesin Analog Mixed

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1. **目标与挑战**:Alphawave Semi团队提出创新布局优化方法,解决有机中介衬底(Organic Interposer)在UCIe xA64 36Gbps信号传输中的串扰(crosstalk)和布线难题。 2. **核心创新**: - **新型Via扇出与布线模式**:在45μm对角微凸块间设置扇出区,形成宽信号通道,容纳优化GSG(信号-地-信号)布线(信号宽2μm、地宽8.6μm、间距2μm)。 - **交替层分配**:减少Via和布线拥堵,提升信号完整性。 3. **性能验证**: - 通过2D/3D EM工具优化,VTF-ICR(串扰比)达34.7dB,满足UCIe-36Gbps眼图要求(BER 1E-15)。 - 系统级仿真确认36Gbps可行性,突破有机中介衬底传统限制。
**UCIe 36Gbps如何实现?** **有机基板有何创新?** **信号完整性如何优化?**
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