当前位置:首页 > 报告详情

DC25_PAPER_Track07_NovelMethodForImprovingDifferential_Bloch_V2.pdf

上传人: S** 编号:1240788 2026-05-16 25页 3.49MB

1、 Information Classification:General Novel Method for Improving Differential to Common Signal Integrity Results for 112GB/224GB Gal Matarasso,Xsight Labs Roee Bloch,Xsight Labs Information Classification:General Abstract During the development of our dense,multi-lane high-speed communication products

2、,we discovered that traditional methods are insufficient for improving differential to common mode conversion.Routing all interfaces necessitates PCBs with over 28 layers and numerous length-tuning segments.Simulations indicated that conventional approaches result in lanes with significant mode conv

3、ersion issues.Subsequent VNA measurements on coupon boards corroborated these simulations,validating our concerns.This paper discusses the risks associated with high mode conversion,illustrates the potential consequences of improper PCB routing,and proposes a novel approach to mitigate and enhance m

4、ode conversion.Author Biographies Gal Matarasso is a Signal and Power Integrity Engineer specializing in high-speed communication systems at Xsight Labs.He is involved in developing the next generation of data center switches and EPUs.Gal holds a B.Sc.in Electrical Engineering from Ben-Gurion Univer

5、sity.Roee Bloch is the Lead Engineer for High-Speed Signal and Power Integrity at Xsight Labs.He focuses on developing the next generation of packages and boards,with an emphasis on high-speed interfaces.Prior to his current role,Roee served as a Principal SI Engineer at Marvell Semiconductors and a

6、s an SI Engineer at Intel Corporation.He holds a B.Sc.in Electrical Engineering from HIT Academic Center.Information Classification:General 1.Differential Signaling and Mode Conversion 1.1.Introduction Differential signaling is ubiquitous in high-speed communication systems due to its inherent noise

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **问题背景**:传统方法在112GB/224GB高速通信中难以抑制差分-共模(D2C)转换,导致信号完整性下降,需PCB超28层和大量长度调谐段。 2. **核心问题**:D2C由长度失配、电气长度差异、玻璃纤维 weave效应及非对称传输线引起,增加误码率(BER)、串扰和EMI。 3. **解决方案**: - **仿真优化**:全3D仿真比混合仿真更准确(如SCD21误差达12dB),避免假阳性。 - **设计改进**:避免主传输线长度调谐蛇形线,仅在BGA/连接器处静态调谐,减少阻抗不连续(实测SCD21从-15dB提升至-20dB以上)。 - **其他措施**:对称布线、匹配玻璃纤维 weave间距、减少过渡过孔。 4. **验证**:通过测试板和VNA测量证实,优化后D2C显著降低,通道性能提升。
**如何减少D2C?** **PCB布线有何陷阱?** **仿真方法如何选择?**
客服
商务合作
小程序
服务号
折叠