1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInnovative Design of 224G BGAPinmap and Via StructureXiuguo Jiang(Keysight)Xin Kang(ZTE),Jinlong Li(ZTE),Xiuguo Jiang(Keysight)Guoying Wei(ZT
2、E),Zhongmin Wei(ZTE),Yu Bi(ZTE)2Information Classification:GeneralImageImage SPEAKERSXin KangSignal Integrity Engineer,ZTEXin Kang specializes in the modeling,simulation,and measurement of high-speed links.Her research focuses on via fan-out,impedance,and simulating SerDes signals.She obtained her M
3、asters degree in Integrated Circuit Engineering Design from Xian University of Posts and Telecommunications in 2020.Xiuguo JiangKXiuguo Jiang,is the Manager of Great China EAD SE&CSM of Keysight Technologies,where he focuses on SI,PI,and EMC.He has more than 14 years of experience in Hardware and SI
4、,and published over 5 books on SI,PI,and EE.3Information Classification:GeneralSPEAKERSJinlong LiSignal Integrity Engineer,ZTEJinlong Li was responsible for Optimizing the SIperformance of the BGA array and the transmission line in the PCB in ZTEs high-speed signal analysis team,researching for new
5、technologies that will be suitable for next generation of future products.He holds a Master degree from xidian University,China,In 2014.Zhongmin WeiSignal Integrity Engineer,ZTEZhongmin Wei joined ZTE in 2009.He is responsible for leading the measurement of high speed product.His current interests a
6、re high speed system level analysis and characterization.He received his master degree in Microelectronics from Nanjing University of Aeronautics and Astronautics,China.4Image Guoying WeiSignal Integrity Engineer,ZTEGuoying Wei received her master degree in Instrumentation Engineering from Harbin In