当前位置:首页 > 报告详情

DC25_SLIDES_Track13_InnovativeDesignOf224GBGA_Kang_V2.pdf

上传人: S** 编号:1240887 2026-05-16 25页 4.40MB

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralInnovative Design of 224G BGAPinmap and Via StructureXiuguo Jiang(Keysight)Xin Kang(ZTE),Jinlong Li(ZTE),Xiuguo Jiang(Keysight)Guoying Wei(ZT

2、E),Zhongmin Wei(ZTE),Yu Bi(ZTE)2Information Classification:GeneralImageImage SPEAKERSXin KangSignal Integrity Engineer,ZTEXin Kang specializes in the modeling,simulation,and measurement of high-speed links.Her research focuses on via fan-out,impedance,and simulating SerDes signals.She obtained her M

3、asters degree in Integrated Circuit Engineering Design from Xian University of Posts and Telecommunications in 2020.Xiuguo JiangKXiuguo Jiang,is the Manager of Great China EAD SE&CSM of Keysight Technologies,where he focuses on SI,PI,and EMC.He has more than 14 years of experience in Hardware and SI

4、,and published over 5 books on SI,PI,and EE.3Information Classification:GeneralSPEAKERSJinlong LiSignal Integrity Engineer,ZTEJinlong Li was responsible for Optimizing the SIperformance of the BGA array and the transmission line in the PCB in ZTEs high-speed signal analysis team,researching for new

5、technologies that will be suitable for next generation of future products.He holds a Master degree from xidian University,China,In 2014.Zhongmin WeiSignal Integrity Engineer,ZTEZhongmin Wei joined ZTE in 2009.He is responsible for leading the measurement of high speed product.His current interests a

6、re high speed system level analysis and characterization.He received his master degree in Microelectronics from Nanjing University of Aeronautics and Astronautics,China.4Image Guoying WeiSignal Integrity Engineer,ZTEGuoying Wei received her master degree in Instrumentation Engineering from Harbin In

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **会议与主题**:2025年1月28-30日圣克拉拉会议中心,聚焦224G BGA innovative design。 2. **核心问题**:224G系统需高带宽、低串扰、高信号通密度及良好焊接可靠性。 3. **解决方案**: - **新型BGA via pattern**:via-pad offset设计(BGA引脚间距0.9mm),实现80.98GHz带宽、0.89mV低串扰(ICN_PS-FEXT)、10×10列15对差分信号。 - **创新via结构**:空气隔离孔提升CAF性能,带宽增至91.61GHz,支持448G+速率。 4. **验证效果**:224G系统中,串扰降低97%,COM提升17.7%。
**224G如何实现?** **BGA设计有何创新?** **高速信号如何优化?**
客服
商务合作
小程序
服务号
折叠