DC25_SLIDES_Track4_UseOfThinFilmResistorsIn_Andresakis_V2.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralLightning TalksAdvances in Materials&Processing for PCBs,Modules&Packages“Use of Thin Film Resistors in Organic Substrates for Modules&Chip Pa

2、ckaging”John Andresakis,Quantic Ohmega TicerAndreas Schilloff(Greensource Fabrication),John Andresakis(Quantic Ohmega Ticer),Mark Chasse(Greensource Fabrication)2Information Classification:GeneralImageSPEAKERSJohn AndresakisDirector of Business Development,Quantic Ohmega TicerJohn.A| John Andresakis

3、 has over 40 years of experience manufacturing printed circuit boards and related products.He joined Quantic Ohmega-Ticer in January 2023 and is now the Director of Business Development.He is working on expanding the market for the companys novel thin film resistor technology.3Information Classifica

4、tion:General Introductions and Benefits Manufacturing Process-mSAP Overview Resistor/Conductor Foil Formation Test Vehicle Design Experimental Results Optimization Strategies Future Directions and Opportunities ConclusionAgenda4Information Classification:General Integration of thin film resistors in

5、to organic substrates Key Benefits:o Significant miniaturizationo Reduced need for discrete resistorso Space conservation on substrate surfaceo Compatible with existing production methodso Improved signal integrityIntroduction&Benefits5Information Classification:General Seed Layer Preparation Method

6、s:o Direct Metallizationo Etching Down of 9-18 micron Foilo Sacrificial Carrier Foil Method(preferred)Process Steps:o Seed layer creationo Photoresist application and patterningo Trace plating(12-15 microns)o Photoresist strippingo Quick etch for seed layer and resistor material removal.o 2nd Imagin