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DC25_SLIDES_Track13_ItTakesAVillage224G_Kocsis.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:General224 Gb/s Mated Test Fixtures for ComplianceSam Kocsis(Amphenol)Francesco Di Paulis(University of LAquila)Rick Rabinovich(Keysight Technologies

2、)Kevin Mammenga(Wilder Technologies)Mike Resso(Keysight Technologies)2Information Classification:GeneralImageImage SPEAKERSSam KocsisDirector of Standards and Technology,Amphenolsamuel.kocsisamphenol-Sam Kocsis currently focuses on the proliferation of innovative interconnect solutions.Sam coordinat

3、es Amphenols engagement strategies in industry standards activities across major market segments.Sam holds BSEE and MSEE degrees from the University of Rochester,in Rochester,New York.Francesco Di PaulisResearch Professor,University of LAquila francesco.depaulisunivaq.itFrancesco de Paulis is curren

4、tly a Research Professor at the University of LAquila.His main research interests are in SI/PI design on PCB,packages,interposers and chips,high speed channel characterization and design,RF interference in mixed-signal system,EMI and EMC.3Information Classification:GeneralImageImage SPEAKERSRick Rab

5、inovichDistinguished Engineer,Keysight TRick specialized in 3D modeling of electromagnetic structures and PCB stack-up optimization.Ricks previous positions include Distinguished Member of the Technical Staff at Alcatel-Lucent/Bell Labs,Fellow Associate at Spirent Communications,and senior position

6、at Northrop.IEEE802.3TM Ethernet contributor and voter member for 23 years.Kevin MammengaSenior Design Engineer,Wilder Technologieskevinwilder-Kevin Mammenga is a lead engineer for HCBs,MCBs,and ISI board designs including both 800G and 1.6T OSFP,QSFP-DD,OSFP-XD,and SFP-DD.His other expertise includ

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1. **会议信息**:2025年1月28-30日于圣克拉拉会议中心举办,聚焦224Gb/s高速互连合规测试。 2. **核心议题**: - **测试夹具性能**:224Gb/s PAM4信号下,同轴接口带宽(086/047线缆)、连接器-模块接口的Stub效应(擦除长度Lw需<0.7mm以避免14.2GHz谐振偏移)。 - **合规挑战**:HCB/MCB插入损耗目标3.8dB@53.125GHz,实测平均3.47dB,偏差±0.16dB;回波损耗(ERL)与串扰(ICN)优化。 3. **关键技术**: - 插入损耗优化因素:金层厚度、低损耗介质、线长比。 - 评估指标:FOM ILD(频率加权RMS偏差)量化信号质量。 4. **参与方**:Amphenol、Keysight、Wilder Technologies等企业联合推动标准化。
**224Gb/s测试挑战?** **MTF如何优化信号?** **高速接口如何降损?**
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