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DC25_SLIDES_Track06_EnhancedApplicationofHigh-SpeedFlexibleMaterialsintheArchitecture_shen_v2.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025Information Classification:GeneralEnhanced Application of High-Speed Flexible Materials in the Architecture Design of Network Core EquipmentSpeaker Lu Xiao,(Shengyi Electronics)

2、Paper Auther Dayong Shen(ByteDance)Jian Yang(Ruijie Networks)Guangyuan Zhu(Shengyi Electronics)Yang Liu(Shengyi Technology)2Information Classification:GeneralImageSPEAKERSLu XiaoR&D manager,Shengyi Electronics Co.,LTDLu.X|Lu is a R&D manager at SYE.She has 15 yearsexperience in technology of PCB man

3、ufacture,and focuses on high speed,rigid-flex,thermal dissipation,hybrid,Inlay,cavity and other special PCB structure.3ImageJian YangSenior SI Engineer,Ruijie N|Jian is a Senior SI Engineer at Ruijie Networks,focusses on signal integrity and power integrity studies.He has 8 years of experience in da

4、ta center switch products development.He completed the design of multiple core switches for data centers.Information Classification:GeneralSPEAKERSJun WangHigh Speed PCB Product Manager,Shengyi Electronics4Yang LiuHigh Speed Materials Product Manager,Shengyi TYang has worked as a high-speed material

5、s product manager in SYTECH since 2017.She has 18 years experience in technology and marketing of PCB and material.Guangyuan ZhuChief R&D Engineer,Shengyi ElectronicsGuangyuan.ZGuangyuan engaged rigid-flex board product research and development at SYE.He has published 5papers and 3 patents granted.J

6、un.WJun is a high-speed PCB Product Manager at SYE,focusing on high-speed PCB solutions for data centers.He has 5 years experience in technology and marketing of PCB.Information Classification:GeneralContent5Core Switch Growth and ChallengesFeatures of Existing Core Switches Architecture Feasibility

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1. **会议与主题**:2025年1月28-30日圣克拉拉会议中心,聚焦高速柔性材料在网络核心设备架构设计中的应用。 2. **核心挑战**:下一代核心交换机需支持1024*112G或512*224G SerDes,芯片功耗≥1000W,传统架构面临信号完整性(SI)限制。 3. **创新方案**:提出基于刚柔板(Rigid-Flex)的架构设计,包括水平主板/水平HSIO、垂直主板/水平HSIO等三种方案,通过3D互连缩短布线长度(≤17英寸)。 4. **性能验证**:刚柔板测试显示,50GHz频段内插入损耗稳定,弯曲后性能无显著变化;112G SerDes通道插入损耗21.72dB(Nyquist频率),符合IEEE 802.3标准。 5. **未来方向**:优化刚柔过渡阻抗匹配、减少柔性板层数、提升多气隙结构可靠性。
刚柔板如何革新? 核心交换机新架构? 高速信号如何优化?
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