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DC25_SLIDES_Keynote_TheTransformativePowerOfAccelerated_Linford.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 The Transformative Power of Accelerated Computing and AIJohn Linford,Ph.D.|Lead Technical Product Manager CAE2One Year Rhythm|Supercluster Scale|Full-Stack|CUDA EverywhereNVIDI

2、A BUILDS AI SUPERCOMPUTING INFRASTRUCTUREGrace BlackwellMGX NodeNVLink SwitchQuantum SwitchSpectrum-X SwitchChips Purpose-Built for AI SupercomputingGPU|CPU|DPU|NIC|NVLink Switch|IB Switch|ENET SwitchCUDA DOCA NCCLCluster-Scale SoftwareSystem SoftwareChip SoftwareCUDA-X LibrariesNIMCUDA-AcceleratedA

3、gentic AI LibrariesOmniverseCUDA-AcceleratedPhysical AI LibrariesAccelerated Software StackGB200 NVL72 SuperPODGENERATIVE AI MOMENTUM IN SEMICONDUCTOR MANUFACTURINGCode&Language Translation Architecture Search Verilog Code Generation P&R,Verification,DRC,.AgentEngineering Copilot Engineer Training F

4、ield Service Fab OperationsAgentic Workflow Quality Control Yield Improvement Process OptimizationNVIDIA BUILDS AI TO BUILD CHIPS FOR AI202420192020202120222023HPGCN(Testability)PRIMAL(Power)PowerNet(IR Drop)ParaGraph(Parasitics)GRANNITE(Switching Activity)MAVIREC(IR Drop)DOINN(Lithography)DesignAna

5、lysisChipNeMo(Engineering)VerilogEval(RTL)RTLFixer(RTL)ClusteringAgent(Cell)VerilogCoder(RTL)DesignAssistanceFVAgent(FV)FVEval(FV)OPCAgent(Lithography)FIST(PD)NVCell-RL(Cell)ParaSize(Analog)AutoCRAFT RL(Analog)AutoDMP(PD)DesignOptimization(RL,BO)Graph Cluster(PD)PrefixRL(Synthesis)Transsizer(PD)TAG(

6、Analog)BufFormer(PD)ILILT(Lithography)Dream-GAN(PD)Clustering(Cell)DesignOptimization(Gen AI)VAESA(Arch)BUILDING AN LLM FOR CHIP DESIGNM.Liu et al,ChipNeMoC.-T.Ho et al,VerilogCoderParameter TrainingRetrieval Augmented Generation(RAG)In-Context LearningAgentEXPLOSION OF LLM APPLICATIONS FOR CHIP DES

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1. **NVIDIA构建AI超算基础设施**:推出Grace Blackwell芯片、MGX节点、NVLink/Quantum/Spectrum-X交换机,支持GB200 NVL72 SuperPOD,实现“全栈CUDA加速”。 2. **生成式AI革新芯片设计**:通过ChipNemo等LLM实现RTL生成、EDA脚本编写、缺陷分析,应用案例包括VerilogCoder、AutoCRAFT RL,加速半导体制造。 3. **物理AI驱动工业仿真**:Modulus平台开发数字孪生(如数据中心、风电场),Wistron实现15,000x加速,Siemens Energy优化风机布局达4000x提速。 4. **能效与性能突破**:cuDSS加速工业仿真(3-200x提速),Grace Hopper使ANSYS FLUENT CFD快110x,科学计算能耗降低4-32倍。 5. **实时数字孪生生态**:Omniverse Blueprint连接设计、仿真、优化,构建虚拟工厂(晶圆/设备/工艺孪生),推动实时工程创新。
**AI芯片设计?** (吸引工程师关注AI如何革新芯片设计流程) **物理AI应用?** (吸引工业领域用户探索物理AI在仿真中的潜力) **数字孪生优势?** (吸引制造业从业者了解实时数字孪生的价值)
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