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DC25_SLIDES_Drive_SignalIntegrityForAutomotiveMultigigabit_Hardock.pdf

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1、Nexperia Welcome to ConferenceJanuary 28 30,2025Santa Clara Convention Center1ExpoJanuary 29 30,2025JAN.28 30,2025Information Classification:GeneralSignal Integrity for Automotive Multigigabit Applications when Using ESD ProtectionAndreas Hardock,Nexperia)201High-Speed Interfaces in Auto02Parasitics

2、 of ESD devices,their impact on the SI and how to compensate them03ExamlesConclusion04Nexperia Overview of High-Speed InterfacesCommon High-Speed Bussed in Mobile and AutomotiveEthernetVideo Links/SerDesInfotainmentMGBT11000BT1APIXGMSLFPDLinkASAUSB3.2USB4.0TMThunderboltHDMI 2.1Speed1000Mbps10Gbps10G

3、bpsUp to 12 GbpsUp to 16 GbpsGen0:5GbpsGen1:10GbpsGen2:up to 20Gbps(using Type-C,10 per line pair)Up to 40Gbps(20 Gbps per linepair)Up to 48Gbps(12 per linepair)1-2-34Nexperia Topology of High-Speed Interfaces5 ConnectorCMC optionalOption 1Option 215kV15kV2kVESD robustness corelates with the silicon

4、 area on the chipNexperia On-Chip ESD The higher the datarate the lower ESD robustness60204060801001200,0010,010,1110100Vbr(V)Data Rate(Gbps)Selected trancievers and PHYs100BASE-T11000BASE-T1MGBT1ESD robustnessParasitics of ESD devices,their impact on the SI and how to compensate them02Placeholder f

5、or the classification(Insert header and footer)10Nexperia Signal Integrity Typical channel configurationConnectorConnectorSeveral meters shielded cable(e.g.SPP)System PCB 1System PCB 2Long and lossyTxRxESD ProtectionESD ProtectionLayout for the connector can be tricky.Automotive ChannelMedium Depend

6、ent Interface(MDI)Medium Dependent Interface(MDI)Optimizing Signal Integrity in High-Speed Interfaces when using ESD Protection DevicesNexperia Signal Integrity Typical channel configurationConnectorConnectorSeveral meters shielded cable(e.g.SPP)System PCB 1System PCB 2Long and lossyTxRxESD Protecti

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1. **会议与主题**:2025年1月28-30日圣克拉拉会议中心,聚焦汽车多千兆比特应用中的信号完整性(SI)与ESD保护(Andreas Hardock, Nexperia)。 2. **高速接口挑战**:汽车常用接口(如1000BASE-T1、USB4.0、HDMI 2.1)速率达5-48Gbps,但ESD器件的寄生参数(尤其是电容)会劣化SI,导致比特丢失。 3. **ESD器件影响**: - 电容随数据率升高需降低(如1000BASE-T1需≤0.15pF)。 - 封装技术(如DSN、FCLGA)显著影响带宽(SOD962 DSN达25.6GHz,SOT23仅10.3GHz)。 4. **优化方案**: - 降低ESD器件电容至最低值。 - 通过PCB设计(如GND挖空、阻抗补偿网络)或额外电路补偿电容影响。 5. **结论**:ESD保护需平衡鲁棒性与SI,低寄生电容封装(如FCLGA)及PCB优化是关键。
**汽车高速接口ESD影响?** **如何降低ESD电容影响?** **ESD封装如何优化信号完整性?**
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