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DC25_PAPER_Track05_InnovativeLayoutOptimizationMethodologyVia_Ilamparidhi_V5.pdf

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1、 Information Classification:General Innovative Layout Optimization Methodology and Via Routing Pattern to Enable UCIe-36Gbps in Organic Interposer Ilamparidhi I,Alphawave Semi Suriya Prakash T,Alphawave Semi Yadavalli Jagadeeswari,Alphawave Semi Information Classification:General Acknowledgment I wo

2、uld like to acknowledge Tony Chan Carusone,CTO of Alphawave Semi,Toronto,for his invaluable inspiration and encouragement to explore new ideas and pursue both publication and patent work.His teaching and guidance have fostered innovation within our team,and his dedicated time spent reviewing this pa

3、per and providing insightful feedback was crucial in shaping it into its current form.A special acknowledgment goes to Dustin Dunwell(Director,Analog Mixed-Signal team at Alphawave Semi,Toronto)for his invaluable guidance and unwavering support throughout the development of this paper.His exceptiona

4、l technical expertise in Analog Mixed-Signal systems,readiness to address complex queries,and ability to connect me with domain experts have been instrumental in shaping this work.By fostering an environment of freedom,innovation,and exploration,and encouraging the team to push boundaries,his leader

5、ship has played a crucial role in driving the success of this paper and inspiring groundbreaking contributions I would like to express my sincere gratitude to Nirmal Kshetrapalan(Senior Director of the Interposer Team at Alphawave Semi,Bangalore)for his unwavering support and encouragement throughou

6、t this work.His visionary leadership and dedication to fostering innovation have been instrumental in driving our exploration of new layout ideas for patents and publications.Nirmals commitment to providing the necessary resources for R&D has enabled us to push the boundaries of interposer design.Th

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1. **目标与挑战**:为在有机中介层(Organic Interposer)上实现UCIe xA64模块36Gbps互连,解决因via尺寸大、线宽/间距严苛导致的串扰和信号扇出难题。 2. **优化方法**:采用2D+3D混合电磁提取法,结合电压传输函数(VTF)及VTF串扰损耗比(ICR)优化布局,最优方案(Case 4)信号线宽2μm、地线宽8.6μm、ICR达34.7dB。 3. **创新设计**:提出新型via扇出与布线模式,在45μm微凸块间距内通过交替层分配和 strategic via放置,实现GSG布线,成功将串扰降至UCIe-36G规范要求。 4. **验证结果**:优化后布局通过ADS Chip-let Designer眼图仿真,满足BER 1E-15的UCIe-36G眼高(40mV)和眼宽(0.65UI)要求。
**有机基板挑战?** (针对封装设计工程师,突出有机基板在高速互联中的技术难点,引发兴趣。) **36Gbps如何实现?** (面向高速信号完整性工程师,聚焦UCIe-36Gbps的关键实现路径,吸引技术探索欲。) **创新路由突破?** (针对先进封装研发人员,强调新型Via布线模式的突破性,激发对专利技术的关注。)
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