当前位置:首页 > 报告详情

DC25_SLIDES_Drive_TutorialFeedingTheBeastConsumption_Beeker.pdf

上传人: S** 编号:1240819 2026-05-16 95页 2.73MB

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025 Santa Clara Convention CenterExpoJanuary 2930,2025 Page 0Information Classification:GeneralFeeding the Beast:Consumption-based PCB DesignTutorial Jan 28,2025,9:00 am-11:30 am Ballroom HDaniel Beeker,(NXP Semiconductor)Page 1Inf

2、ormation Classification:GeneralSPEAKERDaniel BeekerTechnical Director,NXP S|NXP.comWith more than 44 years of experience in electronic system design and EMC,Daniel Beeker provides application support for NXP Automotive customers worldwide.Daniel also supports NXP customers globally with special func

3、tion development tools and instrumentation.Daniel specializes in EMC and signal integrity design techniques for systems and PCBs,especially in low-layer count designs.In support of this,Daniel has completed more than 300 PCB design evaluations for customers and internal NXP products.Daniel teaches f

4、ield-based design techniques at NXP and industry conferences worldwide,with more than 200 sessions with more than 7500 attendees since 2010.Daniel is also involved with NXP IC package design and IC development tool teams to support improved EMC performance,working on more than 30 IC designs.Daniels

5、unique approach to EMC is the result of many years of collaboration with one of the fathers of our industry,Ralph Morrison,whose foundation textbook,Grounding and Shielding Techniques,was published in 1967.Ralphs science-based approach to design has formed the basis for Daniels design philosophy,whi

6、ch has resulted in consistent success in both his designs and those of his students.Daniel also attributes his success to his association with another industry leader,Rick Hartley.The influence of these two extremely knowledgeable mentors can be seen in Daniels material and his passion for sharing t

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **核心观点**:电磁能量在导体间的“空间”(介质)中传输,而非导体本身;电路设计应聚焦“空间”而非“导线”。 2. **关键数据**: - 波速:FR4板材中信号传播速度为150mm/ns(6英寸/纳秒)。 - 能量需求示例:LS1043A处理器核心需8A电流,1.6GHz时钟下每周期需0.004375库仑能量。 - 电容响应:0402封装电容因几何尺寸小,响应速度更快。 3. **设计原则**: - 传输线需为“导体-空间-导体”结构,电源层与地层需相邻(单介质间隔)。 - 能量存储需分层级:芯片电容→BGA电容→局部旁路电容→ bulk电容,按开关速度匹配几何尺寸。 4. **EMC优化**:通过合理布局减少“耗尽波”辐射,无需依赖磁珠或电感。
能量如何传输? PCB设计新规则? EMC问题如何解决?
客服
商务合作
小程序
服务号
折叠