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DC25_PAPER_Track13_ItTakesAVillage224Gbs_Kocsis.pdf

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1、 Information Classification:General It Takes a Village:224Gb/s Mated Test Fixtures for Compliance Sam Kocsis,Amphenol Kevin Mammenga,Wilder Technologies Mike Resso,Keysight Technologies Rick Rabinovich,Keysight Technologies Francesco De Paulis,University of LAquila Information Classification:General

2、 Abstract They say,“it takes a village”,and this session will bring perspectives from the test and measurement experts,fixture and interconnect suppliers,and the academic community to present a comprehensive view on 224 Gb/s mated test fixtures.The group will provide an overview of compliance test f

3、ixtures and offer details for the implementation of Mated Test Fixture(MTF in support of 224 Gb/s.The presentation will demonstrate the impact of the effective wipe on the bandwidth and overall performance of a front-panel pluggable module,while promoting performance requirements for 224 Gb/s per la

4、ne applications.Key aspects of measurement bandwidth and capability will be discussed to lay the foundation for the ability to qualify the channels to the appropriate frequency with sufficient quality.The use of advanced software and S-parameter processing tools will aid vector network analyzers(VNA

5、)in converting the measurements into meaningful datapoints.For over 2 years test fixture and interconnect suppliers have been working on ways to enhance the mechanical connection of the pluggable module and capture consistent results across all the lanes in x4,x8 and x16 lane interfaces.The session

6、will explore the challenges faced when creating the fixtures and managing their interaction with the connector receptacle and cage components.Significant attention will be paid to the“effective wipe”and its impact on the bandwidth and overall measurement quality.With the IEEE P802.3djTM project cont

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1. **224Gb/s测试Fixture挑战**:需支持OSFP/QSFP-DD等1.6T模块,测试带宽需达67-110GHz(1.2-2×Nyquist频率),以覆盖PAM4信号完整性。 2. **关键性能指标**:差分插入损耗(HCB≤3.8dB@53.125GHz)、回波损耗(<-10dB)、模式转换、串扰(ICN计算),需确保8通道一致性。 3. **设计难点**: - "有效擦拭"(pad wipe)导致stub谐振,需优化PCB叠层和接地(避免地平面重叠)。 - 阻抗不匹配(如92Ω差分转50Ω系统)需通过S/Z参数转换校准。 4. **合规工具**:采用COM(Channel Operating Margin)脚本评估C2M/C2C通道,结合预加重/均衡补偿损耗。 5. **材料与工艺**:低损耗基材(如PTFE)、铜箔表面粗糙度控制、厚金镀层减少趋肤效应损耗。
**224Gb/s测试难点?** **MTF如何优化带宽?** **阻抗匹配关键在哪?**
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