当前位置:首页 > 报告详情

DC25_PAPER_Track4_FittingLowerLossintoMore_Frankosky V2.pdf

上传人: S** 编号:1240805 2026-05-16 18页 1.31MB

1、 Information Classification:General Fitting Lower Loss into More&Smaller Spaces Jack Frankosky,The Chemours Company ;+1(302)509-9318 Information Classification:General Abstract Chemours,initially as DuPont,began producing fluoropolymer resins following the discovery of PTFE in 1938.Along the way,cop

2、olymers were developed to permit manufacturing operations such as melt extrusion.This paper focuses on enhancements to fluoropolymer systems which enable improved performance in its incorporation in a variety of vehicles for signal transmission.Resins formulated for optimization of mechanical and el

3、ectrical performance improve adhesion(to copper,in particular),without sacrificing low loss characteristics.Signal integrity and lower transmission loss are further reduced by smoother conductors,mitigating loss mechanisms and signal path variation arising through skin-effects.This paper examines im

4、provements realized through the use of design space“accessible”through better adhesion,lower permittivity and lower loss tangent solutions.Current challenges,where this balance is reached,include cable assemblies(coaxial and other configurations);potential new structures which would benefit from the

5、se resin formulations include dielectric-filled waveguide and copper clad laminate.Author Prior to joining The Chemours Company as Applications Development Principal Engineer,Jack has had a variety of roles with Arlon,LLC,W.L.Gore&Associates,Rogers Corporation and the DuPont Company.Jack lives near

6、Kennett Square,Pennsylvania with his wife and some of their children.He tries to get outdoors to go biking,hiking and whitewater kayaking.Information Classification:General Polymer Development and Formulation:PTFE and versions of its co-polymers are usually known best for being inert,resistant to in

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
1. **新型氟聚合物树脂开发**:Chemours公司开发了一种新型共聚物基树脂,在保持低介电常数(Dk≈2.2)和低损耗正切(Df<0.0010)的同时,显著提升了与铜导体的附着力(剥离强度达IPC推荐最小值的2倍)。 2. **表面粗糙度与损耗关系**:实验表明,树脂附着力与铜箔表面粗糙度(Sz)无关(趋势线斜率接近0),但更光滑的铜箔(如HVLP5,Sq=0.1μm)可进一步降低插入损耗,尤其在110GHz高频段。 3. **应用性能提升**: - **电缆**:低Dk允许增大中心导体直径或提高阻抗,降低插入损耗。 - **PCB**:新树脂与光滑铜箔结合,60GHz时插入损耗降低2dB;支持更高阻抗(100Ω)差分对设计,同时保持低损耗和更窄堆叠高度。 4. **测试方法验证**:通过矩形波导、分裂柱介质谐振器(SPDR)和平衡圆盘谐振器(BCDR)等方法,确认材料在110GHz内性能稳定,且Z轴Dk与平面值差异小于10%。
**低损耗树脂优势?** **高频信号如何优化?** **铜箔粗糙度影响?**
客服
商务合作
小程序
服务号
折叠