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DC25_SLIDES_Track06_Beyond200GChallengesTowards400GSystems_Radashkevich_V2.pdf

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1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralBeyond 200G Challenges Towards 400G Systems:Investigating OIF and IEEE compliant Channel Design with COM-MLSE Equalization.Implementation,Meas

2、urement and Correlation.Ilia Radashkevich,AlteraAlex Manukovsky(Intel),Shaked Naim(Altera),Amir Laufer(Altera),Itamar Levin(Altera)2Information Classification:GeneralImageSPEAKERIlia Radashkevich SIPD Team Lead,AlteraIlia.RTeam Leader of the Signal and Power Integrity team at Altera Analog Mixed Sig

3、nal division,responsible for development,design,simulation and measurement of package and boards for validation of next generation Altera HSIOs IPs such as 112Gbps and 224Gbps and beyond.3Information Classification:GeneralContents4Introduction and Design ChallengesSerDes Considerations:Traditional E

4、qualization and MLSDThe Challenges of 200G E2E Channels DesignE2E Channels Simulation and Measurement CorrelationCase Study:200G Channel PerformanceChallenges Towards 400G SystemsConclusionsGenerated by Microsoft CopilotInformation Classification:General Typical 200G Link:Package,Socket,PCB,Connecto

5、rs,Cables.Unique challenges posed by each component.Importance of accurate analysis methods.Introduction and Design Challenges5These challenges become harder looking forward toward 400G links.Information Classification:General Inter symbol interference(ISI)is probably the major factor dominating the

6、 performance of any E2E link.ISI and Traditional Equalization TechniquesTraditional equalizations techniques:Feed-Forward Equalization(FFE)Decision Feedback Equalization(DFE)6MLSDData OutRecently stepped up to the Maximum Likelihood Sequence Detection(MLSD).Figure from(Sam Palermo,2023)cursorpost-cu

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1. **会议与主题**:2025年1月28-30日圣克拉拉会议中心,聚焦200G向400G系统演进中的通道设计挑战,采用COM-MLSE均衡技术。 2. **200G通道挑战**:端到端(E2E)通道需优化封装(12层堆叠、0.8mm BGA)、PCB(跳层布线)及连接器(OSFP),56GHz插入损耗达35dB。 3. **MLSD技术优势**:相比传统FFE/DFE,MLSD提升COM性能1-1.5dB,支持更高损耗(如40dB+)和更多通道拓扑,47%通道通过COM阈值。 4. **400G演进方向**:PAM4/PAM6/PAM8调制权衡,PAM6在带宽与SNR间较平衡;需解决亚皮秒级偏斜(如448G PAM4需<1.33ps)。 5. **关键结论**:精确建模(封装-PCB-插座协同)与测量(如ECal校准)是基础,MLSD是高损耗通道的核心解决方案。
**200G通道挑战?** (聚焦高速通道设计中的关键难题,吸引工程师关注技术瓶颈。) **MLSD如何提升性能?** (突出MLSD技术的优势,引发对下一代SerDes解决方案的兴趣。) **400G调制方案?** (针对未来速率需求,探讨PAM4/6/8的权衡,吸引系统设计者讨论。)
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