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DC25_SLIDES_Track13_ParameterizedCOMAnalysisTool_Pupalaikis.pdf

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1、1Parameterized COM Analysis Tool For Substrate Routing Impedance StudyTrack 13,Ballroom E Wed,Jan 29,2025,2:00 pm-2:45 pmPete Pupalaikis,Brett SawyerNubis Communications,Inc.2IntroductionSubstrate AnalysisParameterized COMResultsFurther AnalysisConclusionOutline1Introduction2Substrate Analysis3Param

2、eterized COM4Results5Further Analysis6Conclusion3IntroductionSubstrate AnalysisParameterized COMResultsFurther AnalysisConclusionOutline1Introduction2Substrate Analysis3Parameterized COM4Results5Further Analysis6Conclusion4IntroductionSubstrate AnalysisParameterized COMResultsFurther AnalysisConclus

3、ionIntroductionIn the design of an electro-optical transceiver at our company,we tried to answerthe following question:What impedance does the substrate need to be routed at,and what arethe implications of this choice?To answer this question,we turned to COM,the arbiter of channel compliance forvari

4、ous standards.In this paper we:created a framework in which schematic projects could be swept and COManalysis performed,We answered the question,at least for the models and parameters we choseto examine,using COM and ERL as a check.In the process,we were able to identify some problems in our design,

5、andthese problems are highlighted.5IntroductionSubstrate AnalysisParameterized COMResultsFurther AnalysisConclusionOutline1Introduction2Substrate Analysis3Parameterized COM4Results5Further Analysis6Conclusion6IntroductionSubstrate AnalysisParameterized COMResultsFurther AnalysisConclusionChannel Mod

6、elThe substrate analysis is actually a channel analysis,with the module as a component of the channel,and the substrate a component of the module.Channel modeldie bump model,COMpackage model,modulemodel?,host trace model Module modelPIC routing model,substratemodel?,socket model Substrate modelwire

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1. **研究目的**:确定光收发器设计中 substrate 路由阻抗及其影响,通过 COM(通道合规性)和 ERL(回波损耗限制)分析解答。 2. **方法**:开发参数化 COM 工具,对 substrate 阻抗(85–110Ω)、host trace 阻抗(80–110Ω)、长度、32 条通道及 2 种 socket 类型进行 3200 次仿真。 3. **核心发现**: - COM 分析显示 substrate 阻碍选择影响不大,但 27 路由类型存在问题,移除后结果更优。 - ERL 分析表明,substrate 90–95Ω + host 90–100Ω 组合最佳(1 英寸长度时仍有部分失败)。 4. **设计问题**:TDR 诊断发现 substrate 微过孔返回路径设计不当,增加电感和串扰风险。 5. **工具**:Python 开发的 COMSweepTool(GitHub 开源)支持参数化通道模型扫描。
**阻抗如何选择?** (针对 substrate routing impedance 的设计决策,吸引关注信号完整性的工程师) **COM工具有何优势?** (突出 parameterized COM 的自动化和高效性,吸引需要优化设计流程的受众) **TDR如何诊断问题?** (强调 TDR 分析的实际应用,吸引关注硬件调试和故障排查的读者)
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