2024年高性能芯片研讨会(HOT Chips 2024)嘉宾演讲PPT合集(共37套打包)

2024年高性能芯片研讨会(HOT Chips 2024)嘉宾演讲PPT合集(共37套打包)

更新时间:2025-01-17 报告数量:37份

黑洞和TT-金属——独立的人工智能计算机及其编程模型.pdf   黑洞和TT-金属——独立的人工智能计算机及其编程模型.pdf
面向NVIDIA加速计算的下一代冷却技术.pdf   面向NVIDIA加速计算的下一代冷却技术.pdf
数据中心-爆炸性增长带来热效应:固态冷却的力量和潜力.pdf   数据中心-爆炸性增长带来热效应:固态冷却的力量和潜力.pdf
边缘设备的散热挑战.pdf   边缘设备的散热挑战.pdf
支持下一代纵向扩展架构具有光学连接的人工智能计算ASIC.pdf   支持下一代纵向扩展架构具有光学连接的人工智能计算ASIC.pdf
面向边缘构建:下一代英特尔Xeon® 6 SoC.pdf   面向边缘构建:下一代英特尔Xeon® 6 SoC.pdf
英伟达Blackwell平台:推进生成式人工智能和加速计算.pdf   英伟达Blackwell平台:推进生成式人工智能和加速计算.pdf
热门芯片2024大会介绍:人工智能辅助硬件设计.pdf   热门芯片2024大会介绍:人工智能辅助硬件设计.pdf
固态主动冷却有助于维持摩尔定律.pdf   固态主动冷却有助于维持摩尔定律.pdf
面向视觉和汽车的AMD Versal AI Edge系列第二代.pdf   面向视觉和汽车的AMD Versal AI Edge系列第二代.pdf
芯片设计人工智能导论.pdf   芯片设计人工智能导论.pdf
晶圆级人工智能:实现前所未有的人工智能计算性能.pdf   晶圆级人工智能:实现前所未有的人工智能计算性能.pdf
可预测的扩展和基础设施.pdf   可预测的扩展和基础设施.pdf
SK海力士人工智能专用计算内存解决方案:从AiM设备到异构AiMX-xPU系统实现全面的LLM推理.pdf   SK海力士人工智能专用计算内存解决方案:从AiM设备到异构AiMX-xPU系统实现全面的LLM推理.pdf
Lunar Lake:驱动下一代人工智能电脑.pdf   Lunar Lake:驱动下一代人工智能电脑.pdf
领域自适应LLM模型.pdf   领域自适应LLM模型.pdf
英特尔Gaudi 3人工智能加速器:专为人工智能训练和推理而设计.pdf   英特尔Gaudi 3人工智能加速器:专为人工智能训练和推理而设计.pdf
用于XPU到XPU连接的4 Tbit每秒光计算互连小芯片.pdf   用于XPU到XPU连接的4 Tbit每秒光计算互连小芯片.pdf
大语言模型LLM和芯片设计.pdf   大语言模型LLM和芯片设计.pdf
下一代MTIA元推荐推理加速器.pdf   下一代MTIA元推荐推理加速器.pdf
MN-Core 2:面向人工智能和通用HPC应用的第二代MN-Core架构处理器.pdf   MN-Core 2:面向人工智能和通用HPC应用的第二代MN-Core架构处理器.pdf
DOJO:使用以太网传输协议(TTPoE)的Exa级有损人工智能网络.pdf   DOJO:使用以太网传输协议(TTPoE)的Exa级有损人工智能网络.pdf
芯片设计LLM代理.pdf   芯片设计LLM代理.pdf
人工智能辅助芯片设计教程.pdf   人工智能辅助芯片设计教程.pdf
SambaNova SN40L RDU:突破万亿+参数规模Gen AI计算的壁垒.pdf   SambaNova SN40L RDU:突破万亿+参数规模Gen AI计算的壁垒.pdf
骁龙X精英高通CPU:设计和架构概述.pdf   骁龙X精英高通CPU:设计和架构概述.pdf
用于提高数据中心计算密度的散热技术.pdf   用于提高数据中心计算密度的散热技术.pdf
人工智能普及的人生之旅.pdf   人工智能普及的人生之旅.pdf
Onyx:稀疏张量代数的可编程加速器.pdf   Onyx:稀疏张量代数的可编程加速器.pdf
FuriosaAI RNGD:用于可持续人工智能计算的张量收缩处理.pdf   FuriosaAI RNGD:用于可持续人工智能计算的张量收缩处理.pdf
ACF-S:用于人工智能和加速计算网络中高性能数据移动的8-Tbit每秒的超级网卡.pdf   ACF-S:用于人工智能和加速计算网络中高性能数据移动的8-Tbit每秒的超级网卡.pdf
MAIA 100内部.pdf   MAIA 100内部.pdf
XiangShan:符合工业级标准的高性能RISC-V处理器开源项目.pdf   XiangShan:符合工业级标准的高性能RISC-V处理器开源项目.pdf
AmpereOne:面向人工智能和云原生工作负载的可持续计算.pdf   AmpereOne:面向人工智能和云原生工作负载的可持续计算.pdf
AMD下一代“Zen 5”内核.pdf   AMD下一代“Zen 5”内核.pdf
AMD InstinctTM MI300X生成式人工智能加速器和平台架构.pdf   AMD InstinctTM MI300X生成式人工智能加速器和平台架构.pdf
IBM下一代处理器和人工智能加速器.pdf   IBM下一代处理器和人工智能加速器.pdf

报告合集目录

报告预览

  • 全部
    • 2024年高性能芯片研讨会(HOT Chips 2024)嘉宾演讲PPT合集
      • 黑洞和TT-金属——独立的人工智能计算机及其编程模型.pdf
      • 面向NVIDIA加速计算的下一代冷却技术.pdf
      • 数据中心-爆炸性增长带来热效应:固态冷却的力量和潜力.pdf
      • 边缘设备的散热挑战.pdf
      • 支持下一代纵向扩展架构具有光学连接的人工智能计算ASIC.pdf
      • 面向边缘构建:下一代英特尔Xeon® 6 SoC.pdf
      • 英伟达Blackwell平台:推进生成式人工智能和加速计算.pdf
      • 热门芯片2024大会介绍:人工智能辅助硬件设计.pdf
      • 固态主动冷却有助于维持摩尔定律.pdf
      • 面向视觉和汽车的AMD Versal AI Edge系列第二代.pdf
      • 芯片设计人工智能导论.pdf
      • 晶圆级人工智能:实现前所未有的人工智能计算性能.pdf
      • 可预测的扩展和基础设施.pdf
      • SK海力士人工智能专用计算内存解决方案:从AiM设备到异构AiMX-xPU系统实现全面的LLM推理.pdf
      • Lunar Lake:驱动下一代人工智能电脑.pdf
      • 领域自适应LLM模型.pdf
      • 英特尔Gaudi 3人工智能加速器:专为人工智能训练和推理而设计.pdf
      • 用于XPU到XPU连接的4 Tbit每秒光计算互连小芯片.pdf
      • 大语言模型LLM和芯片设计.pdf
      • 下一代MTIA元推荐推理加速器.pdf
      • MN-Core 2:面向人工智能和通用HPC应用的第二代MN-Core架构处理器.pdf
      • DOJO:使用以太网传输协议(TTPoE)的Exa级有损人工智能网络.pdf
      • 芯片设计LLM代理.pdf
      • 人工智能辅助芯片设计教程.pdf
      • SambaNova SN40L RDU:突破万亿+参数规模Gen AI计算的壁垒.pdf
      • 骁龙X精英高通CPU:设计和架构概述.pdf
      • 用于提高数据中心计算密度的散热技术.pdf
      • 人工智能普及的人生之旅.pdf
      • Onyx:稀疏张量代数的可编程加速器.pdf
      • FuriosaAI RNGD:用于可持续人工智能计算的张量收缩处理.pdf
      • ACF-S:用于人工智能和加速计算网络中高性能数据移动的8-Tbit每秒的超级网卡.pdf
      • MAIA 100内部.pdf
      • XiangShan:符合工业级标准的高性能RISC-V处理器开源项目.pdf
      • AmpereOne:面向人工智能和云原生工作负载的可持续计算.pdf
      • AMD下一代“Zen 5”内核.pdf
      • AMD InstinctTM MI300X生成式人工智能加速器和平台架构.pdf
      • IBM下一代处理器和人工智能加速器.pdf
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资源包简介:

1、Blackhole&TT-MetaliumThe Standalone AI Computer and its Programming ModelAugust 2024Jasmina Vasiljevic,Senior FellowDavor Capalija,Senior FellowAgenda Architecture Micro-architecture Scale-out So。

2、Next-Generation Cooling For NVIDIA Accelerated ComputingAli Heydari,Director,Data Center Cooling&InfrastructureAug 25,2024Era of AIApplication FrameworksThe 3 connected dynamics to give Million-X。

3、 2024 Phononic.All rights reserved.Phononic Confidential./Datacenters:Explosive Growth Meets Thermal ConsequencesPower&Potential of Solid State CoolingAugust 25th,2024/2024 Phononic.All rights re。

4、Snapdragon and Qualcomm branded products are products of Qualcomm Technologies,Inc.and/or its subsidiaries.On-device AI and its thermal implicationsNader Nikfar,Sr.Dir.of TechnologyQualcomm Technolog。

5、1Broadcom Proprietary and Confidential.Copyright 2023 Broadcom.All Rights Reserved.The term“Broadcom”refers to Broadcom Inc.and/or its subsidiaries.|Broadcom Proprietary and Confidential.Copyright 20。

6、August 2024Built for the Edge:The Intel Xeon 6 SoCPraveen MosurIntel Fellow 2Edge is the Next Frontier in Digital Transformation Secure,connected,managedCompute density for AI&scalar workloadsInt。

7、NVIDIA Blackwell Platform:Advancing Generative AI and Accelerated ComputingAjay Tirumala,Raymond Wong|NVIDIANVIDIA Blackwell Platform Data Center Scale Architecture Blackwell GPUNVIDIA Quasar Quantiz。

8、HOT Chips 2024:AI Assisted Hardware DesignWill AI Elevate or Replace Hardware Engineers?Bryan Chin(UCSD),Mark Ren(NVIDIA),Stelios Diamantidis(Synopsys),Hanxian Huang(UCSD),Jishen Zhao(UCSD)HotChips 2。

9、AirJet:Solid-state active cooling helps maintain Moores LawHotChips 2024Moores Law Dead?Transistor counts increasingDie sizes are increasingPower/transistor is stallingTotal Heat is increasingThermal。

10、AMD VersalAI Edge Series Gen 2 for Vision and AutomotiveTomai Knopp and Jeffrey ChuCo-author:Sagheer AhmadHot Chips 20242|AMD VERSAL AI EDGE SERIES GEN 2 FOR VISION AND AUTOMOTIVE|AUGUST 2024Agenda C。

11、Introduction to AI for Chip DesignHaoxing(Mark)Ren,Director of Design Automation Research,NVIDIA08/25/2024AI for Design Performance and ProductivityAnalysisFasterPredictiveCross-StageOptimizationFast。

12、Wafer-Scale AI:GPU Impossible PerformanceSean Lie,Co-founder and CTO,Cerebras SystemsHot Chips 2024Cerebras SystemsFounded in 2016400 EmployeesOfficesSilicon Valley|San Diego|Toronto|BangaloreCustome。

13、ConfidentialPredictable Scaling and InfrastructureTrevor CaiConfidentialPredictable Scaling2Confidential What Collect a dataset of text,code,images,audio,math.Pre-train a model to predict the next wo。

14、SK hynix AI-Specific Computing Memory Solution:From AiM device to Heterogeneous AiMX-xPU System for Comprehensive LLM InferenceGuhyun Kim1,Jinkwon Kim1,Nahsung Kim1,Woojae Shin1,Jongsoon Won1,Hyunha 。

15、Lunar Lake Architecture SessionHotChips 2024Arik GihonSenior Principal Engineer,CCGSoC ArchitectureBreakthrough x86 power efficiencyMassive leap in graphicsUnmatched AI computeExceptional core perfor。

16、Domain-adaptive LLMs for Chip DesignTutorial 1:AI Assisted Hardware Design-Will AI Elevate or Replace Hardware Engineers?Hanxian HuangAdvisor:Prof.Jishen ZhaoUniversity of California San Diego1Outlin。

17、August 2024Intel Gaudi 3 AI Accelerator:Architected for Gen AI Training and InferenceRoman Kaplan,Ph.D.Principal AI Performance Architect Intel CorporationAugust 20242Product ParameterGaudi Gaudi 2Ga。

18、4 Tb/s Optical Compute Interconnect Chiplet for XPU-to-XPU Connectivity2024 Hot Chips Saeed Fathololoumi,Intel CorporationAugust 20242Integrated Photonics Solutions2024 Hot Chips Evolution of Optical。

19、HotChips 2024 TutorialHans Bouwmeester,PrimisAIOutline1.Introduction to LLMs2.Introduction to RAG3.From LLM+RAG to EDA AI-Agentv41.Introduction to LLMsWhat is an LLM?Large Language ModelArchitectureP。

20、Next Gen MTIA Next Gen MTIA-Recommendation Inference AcceleratorRecommendation Inference AcceleratorMahesh Maddury,Pankaj Kansal,Olivia WuAcknowledgementAcknowledgementPrahlad Venkatapuram,Linda Chen。

21、MN-Core 2:Second-generation processor of MN-Core architecture for AI and general-purpose HPC applicationJun MakinoPreferred Networks,Inc./Kobe UniversitySummary2MN-Core is a series of AI-oriented acc。

22、HOT CHIPS 2024Tesla Transport Protocol over Ethernet(TTPoE)A new lossy,Exa-Scale fabric for the Dojo AI SupercomputerEric Quinnell,Ph.D.Dojo Fabric Lead2HOT CHIPS 2024Problem StatementTCP/IP is too s。

23、LLM Agents for Chip DesignHaoxing(Mark)Ren,Director of Design Automation Research,NVIDIA08/25/2024Agent AdvantageLLama3GPT4turbo020406080100Non-agentic41.7%Agentic67.3%(VerilogCoder)Non-agentic60.3%A。

24、AI-Assisted Chip Design TutorialHotChipsStelios DiamantidisSynopsys Distinguished Architect25 August 2025(c)2024 Synopsys,Inc.AI-driven Optimization for Chip Design1.Motivation Why AI for Optimizatio。

25、SambaNova SN40L RDU:Breaking the Barrier of Trillion+Parameter Scale Gen AI ComputingRaghu PrabhakarArchitect,SambaNova SystemsHotChips 2024Copyright 2024 SambaNova Systems Inc.SN40L:SambaNovas New L。

26、1Snapdragon and Qualcomm branded products are products of Qualcomm Technologies,Inc.and/or its subsidiaries.June 2024Snapdragon X65 5G ModemQualcomm FastConnectTM 7800 Wi-Fi&BluetoothQualcomm Ory。

27、Thermal Techniques Thermal Techniques for Data Center for Data Center Compute DensityCompute DensityTom GarvensSupermicroVP Hardware Solutions Better Faster Greener 2024 SupermicroAgendaAgendaBetter 。

28、The Journey to AI PervasivenessVictor PengPresident,AMD2|1960s1989Early History:Supervised Learning,Perceptrons,MNISTEvolution of AIV11 M Chip1984Early NPUs at ISSCC1991Alpha 2126419983|1960sEarly Hi。

29、Onyx:A Programmable Accelerator for Sparse Tensor AlgebraKalhan Koul1,Maxwell Strange1,Jackson Melchert1,Alex Carsello1,Yuchen Mei1,Olivia Hsu1,Taeyoung Kong1,Po-Han Chen1,Huifeng Ke1,Keyi Zhang1,Qia。

30、 2024 FuriosaAI Inc.RNGD Tensor Contraction Processor for Sustainable AI ComputingRNGD Tensor Contraction Processor for Sustainable AI ComputingJune Paik,Co-Founder and CEO of FuriosaAI 2024 FuriosaA。

31、 2024 ENFABRICA CORPORATION.ALL RIGHTS RESERVED.UNLEASH THE REVOLUTION IN NEXT-GEN COMPUTING ACF-S:An 8-Terabit/sec SuperNIC for High-Performance Data Movement in AI&Accelerated Compute NetworksH。

32、Inside Maia 100Sherry Xu,Partner Lead SOC ArchitectChandru Ramakrishnan,Partner SW Eng ManagerMaia 100 IntroductionMicrosofts 1st-gen custom AI Accelerator Targets large-scale AI workloads Designed s。

33、XiangShan:An Open-Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards1 Institute of Computing Technology,Chinese Academy of Sciences2 University of Chinese Academ。

34、Sustainable Computing for AI&Cloud Native WorkloadsMatthew Erler-ArchitectAug 27,2024A MODERN SEMICONDUCTOR COMPANY BUILDING THE FIRST CLOUD NATIVE PROCESSORSFOR THE SUSTAINABLE CLOUDTurbo Freque。

35、Next Generation“Zen 5”Core Brad Cohen and Mahesh SubramonyCo-author:Mike ClarkHot Chips 20242|NEXT GENERATION“ZEN 5”CORE|AUGUST 2024“ZEN 4”+14%IPC over“Zen 3”AVX-512 on FP-256 1M L2 VNNI and BFLOAT16。

36、AMD Instinct MI300X Generative AI Accelerator and Platform ArchitectureAlan Smith,Sr.Fellow,Instinct Lead SoC ArchitectVamsi Alla,Fellow,Instinct Chief EngineerHot Chips 20242|AMD INSTINCT MI300X GEN。

37、IBM Telum IIprocessor andIBM SpyreAccelerator chip for AIChris BerryIBM Distinguished Engineer70%of all financial transactions go through an IBM mainframeIBM mainframes run an estimated 70%of all wor。

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