面向边缘构建：下一代英特尔Xeon® 6 SoC.pdf

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1、August 2024Built for the Edge:The Intel Xeon 6 SoCPraveen MosurIntel Fellow 2Edge is the Next Frontier in Digital Transformation Secure,connected,managedCompute density for AI&scalar workloadsIntegrated connectivityOptimized for space&power constrained ruggedized environments No product or component

2、 can be absolutely secure.3The Processor Built for the EdgeConsistent Architecture from Edge to CloudComputeScalar&data parallel workloadsMemoryLow latency,high bandwidthIOHigh bandwidth PCIe Gen 5IntegrationEthernet and acceleratorsRASServer grade robustnessScalabilityMultiple edge systemsbased on

3、one architectureSecurityConfidential AI enabledForm FactorOptimized for space andpower constrained environments Compute OptimizedEdge Optimized4Intel Xeon 6 SoCScalable Architecture,Integrated Form FactorCompatiblePackagesPCI Express&Compute Express Link32LPCIe 5.0IntegratedEthernet8ports2x100G4x50G

4、8x 25G,10G,1G,100MRedwood CoveP-CoreIntelData StreamingAcceleratorIntel Dynamic Load BalancerIntel QuickAssistTechnology16LPCIe 4.016LCXL 2.0IntelvRAN BoostMemoryup to8ChDDR5MultiplexedCombined RankMCRDIMMs4Ch8Ch8 memorychannels4 memorychannelsIntegratedAcceleratorsMediaAccelerator5Intel Xeon 6 SoC

5、Delivering Performance and Efficiency1.See appendix for platform configuration and workload details.Results may vary.3Xincrease in corecount and memory bandwidth1up to2.5Xincrease inIO performance1up to2Xincrease inintegrated Ethernet throughput16Support for a range of core counts and thermals,inclu

6、ding rugged deploymentsSeparate compute andIO chipletsLeading process technology deliverslow power&efficient design Embedded multi-die interconnect bridge(EMIB)packaging enables high bandwidth,low latency cache&memory Modular Product ArchitectureFlexible Design Enables Wider Range of Optimized Produ