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1、ISSCC 2025SESSION 16Invited Industry16.1:Tomahawk 5 51.2Tbps Ethernet Switch 2025 IEEE International Solid-State Circuits Conference1 of 26Tomahawk 551.2Tbps Ethernet SwitchAsad Khamisy,PHD16.1:Tomahawk 5 51.2Tbps Ethernet Switch 2025 IEEE International Solid-State Circuits Conference2 of 26Outline
2、Overview Technology Highlights Packet Flow Monolithic Chip Drivers Low Power,Air Cooled Pizza Box Design TH5-Bailly:Direct Drive Co-Packaged Optics Summary16.1:Tomahawk 5 51.2Tbps Ethernet Switch 2025 IEEE International Solid-State Circuits Conference3 of 26Overview51.2 Tbps Ethernet/IP Switching Ba
3、ndwidth2X bandwidth every 2 years at lower$/Tbps,maintaining Moores LawAccelerates AI WorkloadsCognitive routing,advanced telemetry and congestion controlDiverse Physical Connectivity4m DAC,KR backplane,pluggable optics,LPO/LRO,co-packaged optics50%compared to a typical clock treenOn-chip-variation
4、mitigationSlice_0Slice_1Slice_2Slice_3Slice_31Slice_30Slice_29Slice_28clkclkclkclkclkclkclkclkRoot driver1220m600m600m600m280m600m600m600mclock16.2 RNGD:A 5nm Tensor-Contraction Processor for Power-Efficient Inference on Large Language Models 2025 IEEE International Solid-State Circuits Conference22
5、 of 29HBM Channel Routing Layout2978m2868m234mRDL M4M3DRAM sidePHY sideM2M1Layer M3,M4Layer M2,M1shieldingTop ViewChannel 12Channel 8Channel 4Channel 0Channel 13Channel 9Channel 5Channel 1Channel 14Channel 10Channel 6Channel 2Channel 15Channel 11Channel 7Channel 316-channel DWORD 0-1 DQ 0-31Cross-Se
6、ction ViewMetal 5:VSSMetal 4:SignalMetal 3:VSSMetal 2:SignalMetal 1:VSS1.3m2.0m16.2 RNGD:A 5nm Tensor-Contraction Processor for Power-Efficient Inference on Large Language Models 2025 IEEE International Solid-State Circuits Conference23 of 29HBM Signal and Power IntegritynInterposer RLC extracted wi