20250121_PreConC_Lambalot2.pdf

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1、UCIe Interconnect Design for Standard PackagingDan LambalotSr.Principal EngineerJanuary 21st,2025Email:2Alphawave Semi All Rights Reserved.Confidential-Agenda Brief overview of a typical Organic Package Construction of Core Layer and Buildup Layers Practical considerations Design Optimization and Pl

2、anning for UCIe-S Brief overview of transmission line theory Package trace impedance selection Optimize Trace Width for Power Transfer to Load,Crosstalk,and IR Drop Single-Line Review(no aggressors)Crosstalk Crosstalk Mechanisms Three Coupled Line Review(Presence of two aggressors)Two Coupled Line R

3、eview Bump/Via Transitions Summary3UCIe“Standard Package”Standard packages are typically manufactured using a core material to give the structure mechanical strength Both sides of this thicker core are built up with individual laminate layers and hence this technology is often referred to as Organic

4、 BuildupExample 6-2-6 HDBU(High Density BuildUp Substrate)4Buildup Layers Buildup layers are individually drilled with each layer having a laser drill with corresponding capture pads Every layer has a capture pad for every laser drill Stacking vias can yield better routing density in the signal brea

5、kout region By stacking vias there is less excess capacitance and is better for signal integrity5Core Layer The core layer is a thicker material similar to FR4 used in PCBs and uses a Plated Thru-Hole(PTH)Mechanical Drill For UCIe these PTH are primarily used for power distribution to the BGA balls

6、or to route lower speed Sideband signals below the core6Buildup MaterialCore MaterialAll dielectrics modeled using Djordjevic-Sarkar frequency dependenceCopper layers include surface roughness for enhanced CZ processRa=250nmRa=150nmCopper Surface RoughnessHall-Huray surface ratio=2.97Assembly,Die Sp