20250122_B-102_Knight.PDF

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1、1Enabling Chiplet Reuse and Composable SoCs through StandardizationChiplet Summit22 January 2025Mark KnightVer.A2Vision for an Open Chiplet MarketplaceConcentration of Specialized and Re-Usable ChipletsMany Custom SoCsThe cost of designing and manufacturing highly performant custom SoCs is becoming

2、a barrier to innovationThe cost of designing SoCs can be moderated by enabling composable chiplets to be re-used in a wide array of highly optimized and performant SoCs3The Potential of a Chiplet EcosystemOpportunity of a Chiplet MarketplaceMulti-vendor InteroperabilityLate binding of chiplets to So

3、Cs enables new business modelsCustom SoCs for smaller marketsEcosystem of suppliersLongevityDistributedR&DcostsChiplets as productsTime to marketStandardization as an enablement methodStandardsDesign for manufacture Greater compute density per socket Higher yieldDistributed design and re-use Combine

4、 best of class dies Lower cost to access latest nodesNew business models Democratization of silicon innovation Highly optimized systems4Fragmentation is a Barrier to Re-useEcosystemSilo 1Silo 2Silo 3Design PhilosophyPartitioningInterconnectivityDesign PhilosophyPartitioningInterconnectivityDesign Ph

5、ilosophyPartitioningInterconnectivityFragmented Ecosystem5Key Standardization InitiativesCollaborationContribute,use,and collaborate on existing standardsProtocolsExtend existing on-chip AMBA CHI protocol for use between chipletsPartitioningSystem Architecture requirements that cover partitioning Ar

6、m-based systems across chiplets6The Road to an Open Chiplet MarketplaceSemi-custom chiplet ecosystemStandard partitioning,protocol,transport&PHYs enable design level re-use and composabilityMulti-vendor chiplet marketplaceSilicon qualification&reliabilityPre/post-silicon test&debugLate-binding of ph