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20250121_PreConF_Hutner.PDF

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1、Achieving On-Time Delivery of Production-Ready DesignsMarc HutnerDirector of Product Management for Silicon Learning SiemensMotivation2On-Time DeliveryProduction-ReadyIngredients for hitting marketing window and profitable(Chiplet differentiation is of primary importance,but economics matter)Where d

2、oes yield learning happen3Wafer TestPackage TestSystem Level TestYield Learning happens at every stageWhy does yield matter?4Device yieldTimeEarly process adopterMajority process adopterLate process adopterHistorical Process driven yield curveDesign driven yield curveYield learning identifies layout

3、 issues enabling defect driven yield The outcome is to enable device yield to the process yield curveNew Tech Process driven yield curve(more to learn/stabilize)Chiplet costPer Wafer Cost#good chiplets per waferEquation to minimizeChiplet example of impact of yield5Basic DefinitionExample300mm wafer

4、10mm*10mm parts594 manufactured parts per waferThe goal is to maximize number of good parts for highest possible yieldWhy does this matter?If each wafer costs$10,000*Where each device sells for$25Yield=#good parts#parts manufacturedYield#Good partsCost per partProfit per million parts produced*70%41

5、5$24.10$903,61480%475$21.05$3,947,36890%535$18.73$6,273,408*For latest process nodes cost per wafer$25,000*Highly simplified model,other saving terms in detailed model1%yield improvement=$300kConsider Economics of Multi-Die packages6Consider a 3D/2.5D package4 chiplets per packageEach chiplet cost$2

6、5Package test yield loss 10%Package cost of$50Shifting yield impacts materialImproving yield to 7%at package testCustomer produces 30,000 less parts(less waste)Higher profitability due to less materialProfitability improvement is 3-5x scrap costWhy does this matter?*Highly simplified models,other sa

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本文主要探讨了如何在半导体制造过程中提高生产效率和利润,重点关注了准时交付和生产就绪设计的重要性。文章指出,尽管芯片组差异化对于提高利润至关重要,但经济因素也同样重要。文章还讨论了如何在各个阶段进行产量学习,以及产量对时间和设备销售的影响。 关键数据包括: 1. 生产效率提高1%可以带来高达300万美元的利润增加。 2. 在先进技术节点的芯片封装中,产量学习的复杂性不断增加,需要新的方法。 3. 全球控制信号缺陷可能导致多个扫描链失败,而一个扫描使能缺陷可能会导致单个扫描链失败。 文章还介绍了Tessent公司提供的技术,如高分辨率链诊断工具,可以提高诊断的准确性并减少嫌疑区域,从而加快故障分析速度。文章最后指出,通过使用这些技术,可以同时提高产量和时间到市场(TTM),减少诊断问题所需的努力,并快速做出关于覆盖或设计更改的决定。
如何提高芯片生产准时交付率? 如何在芯片生产中实现成本效益? 先进节点下,如何有效诊断芯片链路故障?
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