AI在测试领域：突破挑战探索新方法.pdf

1、Executive ConferenceArtificialArtificialIntelligenceIntelligenceexplore the power of AI to transform semiconductor design&manufacturingMarc JacobsMarc JacobsFabless SolutionsAI for TestAI for TestChallenges&ApproachesChallenges&ApproachesThis presentation and discussions resulting from it may includ

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5、io visualizations Powered by TIBCO.2024 PDF Solutions,Inc.or its subsidiaries.All rights reserved.Challenges&Challenges&ApproachesApproachesCopyright PDF Solutions 2024Market:System Quality,Cost,DifferentiationMarket:System Quality,Cost,DifferentiationAdaptive TestingAdaptive TestingChiplet Matching

6、/Characterized KGD(cKGD)*/System BinningChiplet Matching/Characterized KGD(cKGD)*/System BinningPredictive BurnPredictive Burn-in/Binning/Systemin/Binning/System-level Testlevel TestSystemSystemWaferWaferChipletChiplet*Source:*Source:Intel,ERI Summit 2023Copyright PDF Solutions 2024InfrastructureInf