面向未来数据中心的光子电子集成技术.pdf

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1、Prof.Peter OBrienHead of Group(Photonics Packaging&Systems Integration)Director(European Photonics Packaging Pilot Line)Tyndall National InstituteUniversity College CorkIrelandPhotonic-Electronic Integration Technologiesfor Future Datacentresfrom research to productionPluggable Transceiver OpticsCo-

2、Packaged OpticsSystem BoardSystem BoardASIC SwitchASIC SwitchOpticsOpticsOpticselectrical pathoptical pathHigher Bandwidth&Lower PowerMove to Co-Packaged OpticsMicro OpticsElectronic IntegrationSource IntegrationElectrical PackagingFibre OpticsThermal ManagementMechanical PackagePhotonic Integrated

3、Circuit(PIC)Photonic-Electronic Co-Packaging TechnologiesThe picture cant be displayed.Integrated silicon photonic MEMSNature Microsystems&Nanoengineering,Vol.9,March 2023.Photonic-Electronic Co-Packaging TechnologiesElectronic-StyleChiplet PackagePhotonic-Electronic Co-Packaging TechnologiesOptical

4、 Fibre ArrayElectrical InterposerPhotonic Chip(optical to electrical)Electronic Chip(FPGA)Electrical Connections(Ball Grid Array)Innovations in fibre array coupling and integration for high-bandwidth FPGA multichip packages,SPIE Photonics West,January 2025.Photonic-Electronic Co-Packaging Technologi

5、es(chiplets)The picture cant be displayed.out-of-planeoptical couplingInP PICGlass Interposer(BGA connections)cavity in glass substrateInP PICPhotonic-Electronic Co-Packaging(technology demonstrator)Photonic-Electronic Co-Packaging(technology demonstrator)2025 OCP EMEA Summit,April 2025Reference The

6、rmal Chips for 2D and 3D Co-Packaging Process Development,IEEE 73rd Electronic Components and Technology Conference,Orlando,2023.Glass Interposers(fabrication&design rules)The picture cant be displayed.The picture cant be displayed.The picture cant be displayed.The picture cant be displayed.200mm Wa