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SNIA-SDC23-Emberson-Singhal-Crasta-Fabric-Attached-Memory.pdf

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1、1|2023 Hewlett Packard Enterprise.All Rights Reserved.Virtual ConferenceSeptember 28-29,2021Fabric Attached MemoryHardware and Software ArchitectureClarete Crasta,Dave Emberson,Sharad Singhal2|2023 Hewlett Packard Enterprise.All Rights Reserved.AgendaMotivation Using fabric attached memory in HPC Ar

2、chitecture Software stackResults and use cases Microbenchmarks Arkouda-based graph processingSummary&future work 3|2023 Hewlett Packard Enterprise.All Rights Reserved.Need quick answers on larger data sizesEXPONENTIALLY INCREASINGDATAEXPLODINGDATASOURCESSHRINKINGTIME TOACTIONMassive advancesin compu

3、ting powerXX=NEEDED EVERYWHEREData nearly doubles every two years(2013-25)Source:IDC Data Age 2025 study,sponsored by Seagate,Nov 2018 4|2023 Hewlett Packard Enterprise.All Rights Reserved.AI and machine learning Applications in simulation,modeling,large language models HPC workflows/pipelines such

4、as those in genomics Applications to transform data in a workflow with large intermediate data sets Large scale graphs Applications inSecurity:website reputation,malware detectionSocial networks:Community detection,link predictionAdvertising:brand reputation,click-through predictionInternet of thing

5、s:traffic management,risk detection Applications have enormous memory footprints Datasets can be 10s-100s of terabytes to multi-petabytes in size Analytics performance is currently limited by the total amount of DRAM in the HPC cluster Random data access patterns Processor caches are inefficient due

6、 to low hit rates Distributed applications often require expert programmers Data movement introduces high latencies Demand paging to SSDs is very slow Moving data consumes time and energy Difficult to optimize system resource locality or network performanceCharacteristics of emerging applications5|2

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本文主要探讨了高性能计算(HPC)领域中,为应对数据密集型应用而提出的异构计算架构。文章指出,现有的超级计算机不适用于这些工作负载,存在一个五个数量级的存储层次结构差距。核心内容包括: 1. 会议概述:2021年9月28日至29日举行的虚拟会议,讨论了与硬件和软件架构相关的主题,如附加内存、高性能计算等。 2. 数据增长:根据2018年IDC数据,数据每两年增长一倍,2025年将达到25ZB。 3. 应用场景:文章提到了人工智能、机器学习、模拟建模、大型语言模型、基因组学工作流程、大数据分析等多种应用场景。 4. 硬件技术进步:介绍了CXL内存、E1.S和E3.S模块、Slingshot互连等技术,以及它们在高性能计算中的潜力。 5. 软件栈:文章提到了OpenFAM、Arkouda、OpenSHMEM等软件组件,以及它们在Fabric Attached Memory(FAM)架构上的应用。 6. 性能测试:通过实验,文章展示了FAM在各种应用中的性能优势,如在LSD Radix Sort中的应用,与仅使用SHMEM的版本相比,混合模式可以使整体应用程序执行时间减少约45至55%。 7. 未来工作:文章提出了对未来工作的展望,包括对CXL内存等未来内存技术的研究,以及OpenSHMEM、Chapel、Arkouda等生态系统的进一步优化。
"Fabric Attached Memory如何提升HPC性能?" "CXL内存技术在HPC中的应用前景如何?" "OpenFAM软件栈在Fabric Attached Memory中的作用是什么?"
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