1、Executive ConferenceArtificialArtificialIntelligenceIntelligenceexplore the power of AI to transform semiconductor design&manufacturingJeff David,PDF Solutions Jeff David,PDF Solutions Edward Zhou,PDF SolutionsEdward Zhou,PDF SolutionsKen Butler,AdvantestKen Butler,AdvantestAI Driven 3DIC TestAI Dri
2、ven 3DIC TestProduct and Architecture OverviewThis presentation and discussions resulting from it may include future product features or fixes,or the expected timing of future releases.This information is intended only to highlight areas of possible future development and current prioritizations.Not
3、hing in this presentation or the discussions stemming from it are a commitment to any future release,new product features or fixes,or the timing of any releases.Actual future releases may or may not include these product features or fixes,and changes to any roadmap or timeline are at the sole discre
4、tion of PDF Solutions,Inc.and may be made without any requirement for updating.For information on current prioritizations and intended future features or fixes,contact .PDF Solutions,Exensio,CV,Cimetrix,the PDF Solutions logo,and the Cimetrix logo are registered trademarks of PDF Solutions,Inc.or it
5、s subsidiaries.All other trademarks cited in this document are the property of their respective owners.Exensio visualizations Powered by TIBCO.2024 PDF Solutions,Inc.or its subsidiaries.All rights reservedCopyright PDF Solutions 2024PDF Solutions PDF Solutions ModelOpsModelOpsCreate,Manage and Contr
6、ol models across their lifecyclesCreate,Manage and Control models across their lifecycles Single platform for all data in Single platform for all data in ExensioExensio Infrastructure for semiconductor-specific dataTrain,deploy,execute,and monitor modelsTrain,deploy,execute,and monitor models Centra