T3 - Fundamentals of Circuit Designs for 2.5D_3D Integration.pdf

1、SpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceISSCC 2024 TutorialsFundamentals of Circuit Designfor 2.5D/3D IntegrationKenny Cheng-Hsiang HsiehTSMC,Hsinchu,TaiwanFeb 18,2024ISSCC Tutorial1Kenny HsiehSpeakerVideoSecurity C-TSMC Secret 2024 IEEE Internationa

2、l Solid-State Circuits ConferenceSelf Introduction Kenny C.H.Hsieh Director in Design Technology Platform of TSMC Leads a division for Analog/Mixed-signal/RF designs30 years in the semiconductor industry,all in circuit designs Interests in high-speed IO mixed-signal circuits Equalization theory in d

3、igital communication2.5D/3D high-performance chipletsDesign/Technology co-optimization of advanced CMOS technologies.Kenny Hsieh2ISSCC TutorialSpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceMotivation to Go ChipletsClassic Problems in ComputingKenny Hsieh3I

4、SSCC Tutorial DraftSpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceVertical IntegrationVertical integration getting everything under the same hoodNear memory computing data localization for low power&low latencyUltra dense vertical connectivity high bandwidt

5、hKenny Hsieh4ISSCC Tutorial DraftSpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceOutline Background of 2.5D/3DIC Die to Die Interconnection Design Chiplet Architecture Complexity Drives For Advanced Solutions Future Trend Prediction ConclusionsKenny Hsieh5IS

6、SCC Tutorial DraftSpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceDevice EvolutionKenny Hsieh6ISSCC Tutorial DraftSpeakerVideoSecurity C-TSMC Secret 2024 IEEE International Solid-State Circuits ConferenceContinued Technology InnovationKenny Hsieh7ISSCC Tutor