F6 - Toward Next Generation of Highly Integrated Electrical and Optical Transceivers.pdf

1、ISSCC 2024Forum 6Toward Next Generation of Highly Integrated Electrical and Optical Transceivers 2024 IEEE International Solid-State Circuits ConferenceForum 6Toward Next Generation of Highly Integrated Electrical and Optical TransceiversISSCC 20241 of 5International Solid State Circuit ConferenceFe

2、bruary 22nd,2024Presentations will start at 8:15am 2024 IEEE International Solid-State Circuits Conference Hosted by the Wireline and TD Subcommittees Organizers:Mozhgan Mansuri,Intel,Hillsboro,OR Jay Im,AMD,San Jose,CA Co-Organizers:Didem Turker Melek,Cadence Design Systems,San Jose,CA Masum Hossai

3、n,Carleton University,Ottawa,Canada Peter Ossieur,Imec,University of Ghent,Ghent,Belgium Sudip Shekhar,University of British Columbia,Vancouver,Canada Tamer Ali,Mediatek,Irvine,CA Champions:Bill Redman-White,HiLight Semiconductor,Southampton,United KingdomYohan Frans,AMD,San Jose,CAOrganizing Commit

4、teeISSCC 2024-Forum 6:Toward Next Generation of Highly Integrated Electrical and Optical Transceivers2 of 5 2024 IEEE International Solid-State Circuits ConferenceThe next generation of highly integrated transceivers for high throughput applications poses significant design challenges in terms of po

5、wer efficiency,signal integrity,ISI and noise cancellation.This forum discusses the key issues for deploying 100G+SERDES and design approaches for 200G+,including noise mitigation,power efficient analog/digital equalization schemes(CTLE,analog FFE,DSP FFE/DFE/MLSD),modulation,and system integration(

6、packaging,connectors,etc).Optical transceivers also play a crucial role in extending the reach of electrical interconnects as data rates continue to increase.Various aspects of optical transceivers based on silicon photonics are discussed,such as foundry perspectives,directly modulated vs coherent o