汽车内饰 IMSE：从技术构思到批量生产准备.pdf

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1、1/TactoTek 2024From Technology Ideation to Serial ReadinessStuttgart,November 14th2024Dr.Thomas Vetter2/TactoTek 2024Conventional electronics rely on multi-layer construction that imposes severe constraints:Separate structural,mechanical and electrical pieces create unnecessary material and energy u

2、seDevices become heavy and large in sizeFlat,rigid and large PCBs dictates formEnvironmentally harmful PCB production requiredIMSEdesign&functional differentiation with minimal use of environmentally harmful materials and processes:One thin,light-weight and visually appealing functional partSingle e

3、fficient process with minimal wasteMinimal or no requirement for PCBsHigh efficiency in lighting electronicsElectronics Construction Today Limits EcoDesign3/TactoTek 2024IMSE Disruption DissectedConventionalFlatMulti-structuralComplexvalue chainsAdditiveCurvedMono-structuralSimplifiedvalue chainsIMS

4、ESubtractive4/TactoTek 20241.Printing of decorations and electronics3.Forming 3D shape with components2.Surface Mounting of components on 2D filmIMSEManufacturing Process4.Injection molding5/TactoTek 2024IMSE TECHNOLOGY JOURNEY FROM IDEATION TO SERIES READINESSOEM Product Development Process&GatesMo

5、nths to SOPIdeationDesignPredevelopmentSeries DevelopmentProductionTec ConceptProduction PreparationToolingIdeation PhaseTec ValidationProof of Concept(PoC)Design PhaseTec Validation OEMTCO Competitive AnalysisPre DevelopmentTec Validation OEM6/TactoTek 2024IMSEValidation OEMValidation TestingMBN103

6、06 tests successfully completed:-K-05 Thermal Shock,-K-09 Damp Heat Cyclic with frost and-K-14 Damp Heat Steady StateThe parameter tests conducted at temperature extremes(-40C,+23C,+85C,and+105C)and operating voltage extremes(+9VDC,+13.5VDC,and+16VDC)Evaluated application includes in-molded micro co