華虹半導體：2019年年度報告.pdf

1、HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:1347)（股份代號：1347）（於香港註冊成立之有限公司）2019年度報告ANNUAL REPORTSUCCESS THROUGH RELENTLESS INNOVATIONContentsDefinitions 2Key Financials 5Letter to Shareholders 6Corporate Information 8Directors and Senior Manage

2、ment Team 11Corporate Governance Report 18Directors Report 282019 Environmental,Social and Governance Report 59Independent Auditors Report 185Consolidated Statement of Profit or Loss 193Consolidated Statement of Comprehensive Income 194Consolidated Statement of Financial Position 195Consolidated Sta

3、tement of Changes in Equity 197Consolidated Statement of Cash Flows 199Notes to Financial Statements 201Five Year Financial Summary 308Definitions2HUA HONG SEMICONDUCTOR LIMITED ANNUAL REpORT 2019In this annual report,unless otherwise required by the context,the following terms shall have the meanin

4、gs set out below.“Annual General Meeting”or “AGM”a hybrid annual general meeting of the Company to be held on 14 May 2020 at 2:00 p.m.,with the combination of a physical meeting at Kowloon Shangri-La Hong Kong,64 Mody Road,Kowloon,Hong Kong and a virtual meeting online;“Board”the Board of Directors

5、of the Company;“China IC Fund”China Integrated Circuit Industry Investment Fund Co.,Ltd.,a company incorporated in the PRC on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain fina

6、ncial institutions and private enterprises.It mainly focuses on the manufacturing of semiconductor wafers and takes into account the upstream and downstream links covering wafer and IC design,package test,equipment and materials etc;“China”or“the PRC”the Peoples Republic of China,but for the purpose