華虹半導體：2021年年度報告.pdf

1、年度報告Empowering the Information EraHUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:1347)（股份代號：1347）（於香港註冊成立之有限公司）ANNUAL REPORT2021章華宏世紀芯圖CONTENTSDefinitions 2Key Financials 6Letter to Shareholders 7Corporate Information 9Directors and Senior Manage

2、ment Team 12Corporate Governance Report 21Directors Report 312021 Environmental,Social and Governance Report 61Independent Auditors Report 197Consolidated Statement of Profit or Loss 205Consolidated Statement of Comprehensive Income 206Consolidated Statement of Financial Position 207Consolidated Sta

3、tement of Changes in Equity 209Consolidated Statement of Cash Flows 211Notes to Financial Statements 213Five Year Financial Summary 3242HUA HONG SEMICONDUCTOR LIMITED ANNUAL REPORT 2021DEFINITIONSIn this annual report,unless otherwise required by the context,the following terms shall have the meanin

4、gs set out below.“Annual General Meeting”or “AGM”an annual general meeting of the Company to be held on 12 May 2022;“Audit Committee”the audit committee of the Board;“Board”the Board of Directors of the Company;“China IC Fund”China Integrated Circuit Industry Investment Fund Co.,Ltd.,a company incor

5、porated in the PRC on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain financial institutions and private enterprises.It mainly focuses on the manufacturing of semiconductor wafer

6、s and takes into account the upstream and downstream links covering wafer and IC design,package test,equipment and materials etc;“China”or“the PRC”the Peoples Republic of China,but for the purpose of this annual report and for geographical reference only and except where otherwise required by the co