華虹半導體：2018年年度報告.pdf

1、HUA HONG SEMICONDUCTOR LIMITED華虹半導體有限公司(Incorporated in Hong Kong with limited liability)(Stock Code:1347)（股份代號：1347）（於香港註冊成立之有限公司）ANNUAL REPORT年度報告2018A True North Bold Journey Definitions 2Key Financials 5Letter to Shareholders 6Corporate Information 8Directors and Senior Management Team 11Corpora

2、te Governance Report 18Directors Report 292018 Environmental,Social and Governance Report 56Independent Auditors Report 167Consolidated Statement of Profit or Loss 175Consolidated Statement of Comprehensive Income 176Consolidated Statement of Financial Position 177Consolidated Statement of Changes i

3、n Equity 179Consolidated Statement of Cash Flows 181Notes to Financial Statements 183Five Year Financial Summary 296Contents2HUA HONG SEMICONDUCTOR LIMITED DefinitionsIn this annual report,unless the context otherwise requires,the following terms shall have the meanings set out below.“Annual General

4、 Meeting”or“AGM”an annual general meeting of the Company to be held on 9 May 2019 at 2:00 p.m.at the Kowloon Shangri-La Hong Kong,64 Mody Road,Kowloon,Hong Kong;“Board”the board of Directors of the Company;“China Integrated Circuit”China Integrated Circuit Industry Investment Fund Co.,Ltd.,a company

5、 incorporated in the PRC on 26 September 2014;its shareholders include the Ministry of Finance,the enterprises in the Integrated Circuit Industry Cluster,large-scale state-owned enterprises,certain financial institutions and private enterprises.It mainly focuses on the manufacturing of semiconductor

6、 wafers and takes into account the upstream and downstream links covering wafer and IC design,package test,equipment and materials et alia;“China”or“the PRC”the Peoples Republic of China,but for the purpose of this annual report and for geographical reference only and except where the context otherw